WMSIC Electronic Components

HCI 8875H-20.000NV33DTL 8875H

Model8875H-20.000NV33DTL
PackageSMD7050-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 8875H-20.000NV33DTL
Type
HCI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
8875H-20.000NV33DTL
Electronic Component
1
Package
SMD7050-4P
Electronic Component
Temperature-Compensated Crystal Oscillator (TCXO)
Electronic Component
1g
Frequency
20MHz
Electronic Component
1
Electronic Component
BM0264779329
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Output
CMOS
Frequency
±280ppb
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

8875H-20.000NV33DTL 产品概述

一、产品简介

8875H-20.000NV33DTL 是杭州晶体(HCI/杭晶)出品的一款高精度温度补偿晶体振荡器(TCXO)。器件输出为标准 CMOS 电平,标称频率 20.000 MHz,工作电压 3.3 V,工作温度范围 -40 ℃ 至 +85 ℃。该器件以“高精度、高稳定性”为设计目标,适合对频率精度与温度稳定性有严格要求的系统使用。

二、主要性能指标

  • 标称频率:20.000 MHz
  • 输出模式:CMOS 方波输出
  • 工作电压:3.3 V
  • 初始频率精度(初始误差):±1 ppm
  • 频率稳定度 / 温度补偿后:±0.28 ppm(±280 ppb)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装形式:SMD 7050-4P(尺寸 7.0 × 5.0 mm,4 引脚)
    这些参数在典型测试条件下获得,具体性能以出厂检验报告为准。

三、主要应用场景

  • 通信基站与网络设备中的时钟源与参考频率
  • 精密测量仪器、测试设备的基准时钟
  • 高可靠性嵌入式系统、定位与导航系统(需高稳定度参考)
  • 无线电、光纤传输、频率合成与参考模块等领域

四、封装与 PCB 布局建议

  • 建议在 VCC 引脚附近放置 0.1 μF 陶瓷去耦电容,尽量靠近器件引脚焊盘焊接;同时在电源线上考虑加入适当的滤波与阻抗控制。
  • 输出线尽量短且恒阻抗,避免长距离走线产生振铃或串扰。
  • 器件底部请保证良好接地,散热通道与地平面连通可提高稳定性。
  • 采用推荐的 7050 封装焊盘和回流温度曲线,遵守元件湿热等级与回流规范以避免焊接损伤。

五、选型与使用注意

  • 初始精度 ±1 ppm 与温度补偿后 ±0.28 ppm 表明该 TCXO 适用于对长期及温度变化敏感的系统;在选型时应核对目标应用的相位噪声、抖动等额外指标(如有要求),并参考厂方完整规格书。
  • 建议在最终系统中进行实际环境下的温漂验证与老化测试,确保满足长期可靠性要求。
  • 注意静电防护与储运湿敏等级,元件应在规定条件下保存与回流焊接。

如需完整规格书、典型相位噪声曲线、封装引脚图或样品测试数据,可联系 HCI(杭晶)或其授权分销渠道获取详细技术资料与应用支持。

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