Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B104K500CT 是一种高性能的多层陶瓷电容器,采用0402(1005 公制)封装,具有体积小、性能稳定的优点。它的电容值为0.1µF,额定电压为50V,适合通用电子电路的应用。电容器的容差为±10%,保证了在电路中能够提供一定的性能稳定性。
本产品采用X7R温度系数材料,适合在具有宽温度范围的环境中使用。X7R材料在-55°C到125°C的环境中,其电容特性变化非常小,确保了电容器在极端环境下的一致性和可靠性。这使得0402B104K500CT成为高可靠性电子设备中常见的选择。
0402B104K500CT电容器广泛应用于各种高频、高速电子设计中,包括但不限于:
由于0402B104K500CT采用表面贴装技术(SMD),在现代电子产品中有广泛的应用。在PCB设计时,设计师需要考虑焊盘的布局,以确保能够顺利进行表面安装。同时,元件的放置要确保附近没有其他电子元件引起的干扰。
在选型时,需要综合考虑电容值、电压、容差等参数,以确保电容器能够满足设计规范要求。此外,0402B104K500CT的体积小,能够在遇到空间不足时成为优选配件。
总之,0402B104K500CT是一款在各类电子应用中表现出色的多层陶瓷电容器,凭借其小巧的体积、高稳定的性能、良好的温度适应性,以及适中的成本,成为众多电子工程师和产品开发者的优先选择。适用于广泛的应用场景,能够显著提高电子设备的性能和可靠性,是现代电子设计中不可或缺的重要元器件。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products