Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B104K100CT是华新科(Walsin)推出的多层陶瓷电容器(MLCC),属于通用型陶瓷电容产品线。型号标识对应核心属性:
该产品采用X7R介质材料,平衡了容值稳定性与温度适应性,适用于低压电子电路的滤波、耦合、旁路等基础功能。
容值为100nF(0.1μF),精度±10%,满足绝大多数通用电路的偏差要求(无需高精度场景即可覆盖)。容值采用行业标准“3位数标识”,前两位为有效数字(10),第三位为10的幂次(4,即10⁴ pF=100nF),识别直观。
额定电压10V,属于低压陶瓷电容范畴,适配5V、3.3V等主流低压供电系统,可有效避免过压击穿风险(实际工作电压需≤额定值)。
采用X7R介质,符合EIA温度特性标准:
相比Y5V(高容值但温度稳定性差)和COG(高精度但容值低),X7R兼顾了稳定性与温度适应性,是通用场景的优选介质。
产品采用0402封装(英制),对应公制尺寸为1005(1.0mm×0.5mm),是小型化表面贴装的典型代表,物理参数如下:
该封装体积小、重量轻,可显著提升PCB布局密度,适合手机、智能穿戴等小型化设备。
工作温度范围为**-55℃~+125℃**,覆盖工业级与汽车级部分场景(需结合具体应用的认证要求),极端温度下仍保持稳定电气性能,避免电路功能异常。
陶瓷介质防潮性优异,可在相对湿度≤95%(无凝露)环境下长期工作;产品符合RoHS 2.0、REACH环保标准,支持无铅回流焊(温度峰值260℃,持续时间≤10秒),焊接可靠性高,批量一致性好。
额定条件下平均无故障时间(MTBF)达数十万小时,长期使用后容值漂移率≤5%,满足通用电路的可靠性需求。
0402B104K100CT因体积小、性能均衡,广泛应用于:
华新科0402B104K100CT是一款高性价比通用MLCC,兼具小型化封装、稳定的X7R介质特性与低压适配能力,可覆盖绝大多数低压电子电路的基础电容需求。产品符合行业标准,可靠性与一致性优异,是消费电子、工业控制等领域的优选组件。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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