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Hottech BAT54
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech BAT54
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- BAT54
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0228550657
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 800mV@100mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54 产品概述
一、产品简介
BAT54 是一种常用的肖特基（Schottky）二极管，用于低压、高速开关与极性保护场合。此型号由 Hottech（合科泰）提供，封装为 SOT-23，适合表面贴装的消费电子与工业控制电路。器件在 100 mA 工作条件下正向压降为 800 mV，兼顾开关速度与低正向压降的需求，适用于空间受限且需要快速恢复的电路。
二、主要参数
- 型号：BAT54（Hottech / 合科泰）
- 封装：SOT-23
- 正向压降（Vf）：800 mV @ 100 mA
- 直流反向耐压（Vr）：30 V
- 最大整流电流（If）：200 mA
- 反向漏电流（Ir）：2 μA @ 25 V
- 工作结温范围：-55 ℃ ~ +150 ℃
三、主要特性与优势
- 低正向压降（相对于普通硅二极管），在中小电流下可降低功耗。
- 肖特基势垒结构带来快速的开关响应，适合高频和整流应用。
- 小型 SOT-23 封装，便于节省 PCB 面积并兼容自动贴装工艺。
- 宽温度范围，适应从严寒到高温的多种环境。
四、典型应用
- 电源线路的极性反接保护与反向电流隔离
- 低压整流与峰值检波电路
- 电平位移、快恢复开关和混合信号电路保护
- 移动设备、小型适配器、传感器接口电源管理
五、封装与热性能
SOT-23 为 3 引脚小封装，需注意器件的热阻比较高，连续大电流会导致结温迅速上升。设计时应：
- 在 PCB 布局中为二极管留出适当的散热铜箔面积；
- 对长时间或高占空比工作进行功耗估算：Pd ≈ Vf × If（例如 0.8 V × 0.1 A = 80 mW）；
- 在高温环境下考虑反向漏电流随温度上升增加的影响。
六、设计注意事项
- 正向压降 800 mV@100 mA，若用于低压（例如 3.3 V 或更低）电源路径，应评估压降带来的效率损失和功耗。
- 最大整流电流 200 mA，瞬态浪涌电流未标注时应谨慎，必要时增加限流器件或使用更大额定电流的器件。
- 反向漏电流 2 μA@25 V 在高温下会增大，敏感模拟或断电保持电路需评估漏电影响。
- 焊接工艺按照 SOT-23 标准进行，避免过高温度或长时间回流，避免封装应力导致性能退化。
七、结论
Hottech（合科泰）SOT-23 封装的 BAT54 是一种适合表贴、空间受限电路的肖特基二极管，提供快速开关和中等电流处理能力。其 30 V 的反向耐压与 200 mA 的整流电流使其在电源保护、整流与接口保护等应用中具有良好性价比。设计时需关注热管理与漏电随温度上升的影响，以确保长期可靠性。
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