WMSIC Electronic Components

Hottech BC848C

ModelBC848C
PackageSOT-23
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech BC848C
Type
HOTTECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
BC848C
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0227655805
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC848C 产品概述

一、产品简介

BC848C 是 Hottech(合科泰)推出的一款低功耗、小尺寸的 NPN 型小信号双极晶体管,封装为 SOT-23。该器件面向通用开关与放大应用,兼顾高直流增益与较宽的频率特性,适合便携与高密度电路板设计。

二、主要电气参数

  • 晶体管类型:NPN
  • 集电极电流 Ic(max):100 mA
  • 集—射极击穿电压 Vceo:30 V
  • 功耗 Pd:200 mW(封装及环境依赖,见数据手册)
  • 直流电流增益 hFE:420 @ Ic = 2 mA, VCE = 5 V(C 级别高增益)
  • 特征频率 fT:100 MHz
  • 集电极截止电流 Icbo:≈100 nA(典型)
  • 集电极饱和电压 VCE(sat):≈500 mV @ Ic = 100 mA, Ib = 5 mA
  • 发—基极反向击穿电压 Vebo:6 V
  • 封装:SOT-23

三、性能特点

  • 高直流增益(hFE 高达 420),在小信号放大场合可减少偏置电流要求,提升灵敏度。
  • fT ≈100 MHz,满足一般音频及低中频放大器与缓冲电路的频率需求。
  • 低漏电流(Icbo 约100 nA),适合高阻抗输入或传感前端场合。
  • SOT-23 小体积,便于表面贴装和高密度布局。

四、封装与热管理

SOT-23 封装便于自动贴装,但散热能力受限,额定耗散功率 Pd = 200 mW(标称值)在实际电路中需考虑环境温度与 PCB 热扩散。建议:

  • 在高电流或持续功耗场景下使用较大铜箔散热或增加过孔改善导热;
  • 根据应用对功耗进行降额设计,确保结温不超限;
  • 参考官方数据手册确定最大结温与热阻参数。

五、典型应用

  • 小信号放大器(前置放大、差分放大等)
  • 低侧或高侧通用开关(通过合适基极驱动)
  • 传感器信号调理、驱动小型继电器或光耦输入(注意功耗与饱和电压)
  • 电平转换与缓冲电路

六、使用建议与注意事项

  • 避免对基-射极施加超过 Vebo = 6 V 的反向电压,以免损伤极间结。
  • 若需要开关 100 mA 级别电流,请保证基极驱动电流足够(参考 VCE(sat) 规格:500 mV @ Ic=100 mA, Ib=5 mA),并注意封装散热限制。
  • 在高阻抗或低漏电要求电路中,Icbo 虽小但仍需考虑温度上升对漏电的影响。
  • 为保证长期可靠性,应在高温环境中对 Pd 进行降额并按 PCB 进行热设计。

七、结论

BC848C(Hottech 合科泰,SOT-23)是一款性能均衡的高增益 NPN 小信号晶体管,适用于对增益、频率和封装尺寸有综合要求的通用电子应用。在使用时需注意封装散热和基极反向电压限制,按照官方数据手册与电路热设计原则进行选型与布局,可在便携设备、传感与信号处理电路中发挥良好效果。若需引脚定义、温度特性和极限参数的详细数值,请参考合科泰官方数据手册。

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