WMSIC Electronic Components

Hottech BZX84C3V9

ModelBZX84C3V9
PackageSOT-23
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech BZX84C3V9
Type
HOTTECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
BZX84C3V9
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
0.03g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
20Ω
Electronic Component
BM0264463946
Diode
1
Current(Ir)
3uA
Power Dissipation(Pd)
350mW
Electronic Component
3.7V~4.1V
Electronic Component
65℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C3V9(Hottech 合科泰)产品概述

一、产品简介

BZX84C3V9 是 Hottech(合科泰)出品的一款独立式稳压二极管,标称稳压值 3.9V,采用 SOT-23 封装,适用于低功耗电压基准与浪涌钳位场合。器件体积小、封装方便,适合表面贴装生产与空间受限的电路板设计。

二、主要参数(摘要)

  • 稳压值(标称):3.9V(规格范围 3.7V ~ 4.1V)
  • 反向漏电流 Ir:3µA(典型低漏流,利于高阻抗参考)
  • 最大耗散功率 Pd:350mW(在规定散热条件下)
  • 动态阻抗 Zzt:20Ω
  • 低电流阻抗 Zzk:600Ω
  • 工作结温范围:-65℃ ~ +150℃
  • 封装:SOT-23(单只独立二极管)

三、性能特性与优势

  • 低耗散设计:350mW 的耗散能力满足多数便携与低功耗模块的稳压需求。
  • 低反向漏电流:3µA 有利于作为参考源或高阻电路中的保护元件,减小待稳电路的静态误差。
  • 良好的稳压特性:低频动态阻抗 Zzt 值较小,能在中等电流变化下维持较稳定的输出电压;Zzk 较大,显示在微安级工作时需要注意电压漂移。
  • 宽温度范围:-65℃~+150℃,适合车规级或工业环境(需参考实际应用的热设计)。

四、典型应用

  • 低功耗电压基准与参考源
  • 小功率电源的过压/反向钳位保护
  • 电平移位或偏置网络
  • 仪表放大器与传感器的局部稳压

五、典型电路与选型建议

常见用法为串联限流电阻与稳压二极管组成的并联稳压(分流式稳压器)。设计时按下式选择限流电阻 R: R = (Vin − Vz) / Iz 其中 Iz 为流过稳压二极管的工作电流(可参照器件数据手册的测试电流)。举例:若取 Iz ≈ 5mA(常见参考工况),在 Vin = 12V、Vz = 3.9V 时: R ≈ (12 − 3.9) / 5mA ≈ 1.62kΩ(可选 1.6kΩ),稳压二极管耗散约 3.9V × 5mA ≈ 19.5mW,远小于 350mW,但在高 Vin 或大 Iz 情况下须检查 Pd 极限并做足散热/降功率设计。

注意事项:

  • 避免长期在接近 Pd 极限下工作,应留有安全余量并考虑环境温度与 PCB 散热。
  • 在微安级工作(接近 Zzk 区域)时,稳压值会较标称值有显著偏差,适用于高阻抗或低电流参考时需校准。
  • SOT-23 封装易于回流焊,但要注意焊接温度曲线避免过热损伤。

六、封装与可靠性

SOT-23 小巧封装利于高密度安装;合科泰在制造与出货检验上通常执行严格的工艺与测试。使用时请参考厂家完整数据手册,关注最大功耗、热阻与电气试验条件,以确保长期稳定性与可靠性。

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