WMSIC Electronic Components

Hottech BC846C

ModelBC846C
PackageSOT-23
BrandHottech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Hottech BC846C
Type
HOTTECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOTTECH
Electronic Component
BC846C
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0265582295
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC846C NPN型双极型晶体管(BJT)产品概述

一、产品核心定位与应用场景

BC846C属于通用型中功率NPN双极型晶体管,针对低功耗、中电压场景优化设计,适配消费电子、工业控制、传感器接口等多个领域。其核心参数(100mA集电极电流、65V集射极耐压、200mW耗散功率)决定了它既适合信号放大,也能胜任小负载开关驱动——比如小型手持设备的音频前置放大、单片机I/O扩展、LED小电流驱动,或是工业传感器的微弱信号调理等场景。

二、关键电气参数详解

BC846C的参数设计平衡了放大性能与可靠性,核心参数的实际意义如下:

1. 直流特性参数

  • 集电极电流(Ic):最大100mA
    持续工作建议控制在80mA以内(降额使用),可驱动小型LED、微型继电器或低功耗负载,避免过载导致器件失效。
  • 集射极击穿电压(Vceo):65V
    无基极电流时集射极最大耐压,实际应用需留10%-20%余量(如电源电压不超过50V),适配一般工业低压信号场景。
  • 直流电流增益(hFE):420@2mA/5V
    属于高增益管,对微弱信号(如传感器输出的μV级信号)放大能力强,减少多级放大的复杂度。
  • 集射极饱和电压(VCE(sat)):500mV@100mA/5mA基极电流
    饱和压降小,开关时损耗低,响应速度快(ns级),适合高频开关场景。
  • 射基极击穿电压(Vebo):6V
    限制基极反向电流,避免基极-发射极反向击穿,保护器件安全。

2. 交流特性参数

  • 特征频率(fT):100MHz
    电流增益降为1时的频率,决定放大带宽——覆盖音频(20Hz-20kHz)、10MHz以下射频辅助放大等场景,性能稳定。

3. 功耗与漏电流

  • 耗散功率(Pd):200mW
    SOT-23封装散热能力有限,实际工作需控制结温(建议不超过150℃),降额至150mW以内使用更可靠。
  • 集电极截止电流(Icbo):100nA
    漏电流极小,低功耗场景下(如电池供电设备)信号失真小,静态功耗低。

三、封装与可靠性设计

BC846C采用SOT-23表面贴装封装,尺寸仅1.6mm×1.0mm(典型值),适配高密度PCB设计(如可穿戴设备、小型控制器),节省空间的同时降低成本。

封装可靠性方面:

  • 引脚采用镀锡工艺,焊接牢固,抗振动性能好(符合IPC标准);
  • 塑封材料耐高温(工作温度范围-55℃~150℃),适应工业环境的温湿度变化;
  • 散热设计:通过PCB铜箔连接引脚增强散热,避免局部过热。

四、品牌与质量保障

BC846C由Hottech(合科泰) 生产,该品牌专注于分立器件研发制造,产品符合:

  • RoHS环保标准(无铅无镉),适配欧盟市场要求;
  • ISO9001质量体系认证,每批次100%参数测试(hFE分选、漏电流检测等);
  • 工业级可靠性测试(高低温循环、振动、老化),批量应用稳定性高。

五、典型应用案例

  1. 音频前置放大:利用高hFE(420)放大手机耳机线控的微弱信号,VCE(sat)小保证音频失真≤0.1%;
  2. 单片机I/O驱动:单片机输出5mA电流,通过BC846C放大至80mA,驱动小型LED指示灯或蜂鸣器;
  3. 传感器信号调理:压力传感器输出1mV信号,经BC846C单端放大至4V(增益4000),适配ADC输入范围;
  4. 低电压开关:3.3V电源下,BC846C作为开关管控制12V/50mA负载,饱和压降仅300mV,损耗低。

总结

BC846C以高增益、低饱和压降、小封装、高可靠性为核心优势,覆盖从信号放大到小负载开关的多场景需求,是消费电子、工业控制、传感器领域的高性价比器件,适合批量生产与稳定运行。

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