Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Hottech MBRD20100CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech MBRD20100CT
- Type
- HOTTECH
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- MBRD20100CT
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.462g
- Electronic Component
- 1
- Electronic Component
- BM0264463969
- Current
- 20A
- Diode
- 1
- Electronic Component
- 45℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage Rating(Vr)
- 100V
- Surge Current (Ifsm)
- 300A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MBRD20100CT 产品概述
一、产品简介
MBRD20100CT 是 Hottech（合科泰）推出的一款高电流双二极管整流器，采用一对共阴极（dual common cathode）结构，单管直流反向耐压（Vr）100V，额定整流电流20A，非重复峰值浪涌电流（Ifsm）300A。工作结温范围宽（-45℃~+125℃），适合各种中大功率开关电源和功率整流场合。器件封装为 TO-252（俗称 DPAK），兼顾表贴工艺与良好散热性能。
二、主要性能特点
- 双二极管、共阴极结构，便于并联或构建输出整流拓扑。
- 100V 反向耐压，满足多数工业与消费类电源安全裕量。
- 20A 额定整流电流，适合中大电流整流需求；300A 峰值浪涌能力，应对启动或容性负载冲击电流。
- 宽温区间（-45℃~+125℃），适应严苛环境工作。
- TO-252 表面贴装封装，体积小、焊接方便且通过 PCB 热铜层实现散热。
三、典型应用
- 开关电源（SMPS）输出整流与回授保护。
- DC-DC 转换器、稳压模块的整流与 freewheeling。
- 汽车电子、车载充电器及蓄电池保护电路（需参考车规要求）。
- 电机驱动与家电控制中的整流与反向保护。
- 电源适配器、充电器及工业电源模块。
四、封装与引脚说明
封装：TO-252（DPAK），三引脚外加散热铜片。
典型引脚功能（以常见封装布局为准）：
- 引脚1：阳极 A1
- 引脚2：阳极 A2
- 引脚3 / 散热片：公共阴极（Cathode）
实际引脚排列请参考厂商数据手册与推荐焊盘图。
五、使用与散热建议
- TO-252 通过焊接到 PCB 上的铜箔实现热量传导，建议在 PCB 设计时加大散热铜箔面积并与多层板散热层相连。
- 长期工作在高电流条件下，应确保结温不超过器件额定上限，必要时并配备散热片或改进布局。
- 在并联使用多颗器件时，注意电流均流与热均衡，多采用相同布局与相同驱动条件。
六、储存与焊接注意事项
- 器件为表贴封装，注意潮湿敏感等级（MSL）与回流焊曲线，遵循厂商推荐的焊接温度与时间。
- 储存环境避免高湿高温，长期存放请参照厂商说明进行防潮处理或真空包装保存。
- 操作过程中注意防静电，避免因 ESD 导致器件损伤。
七、选型与替代建议
在需更高电压或更低正向压降的场合，可考虑更高 Vr 或低 VF 的肖特基器件。选择替代品时请比对关键参数：Vr、平均/脉冲电流、Ifsm、结温范围和封装尺寸，确保能满足散热与布局要求。有关更多详细典型参数与电气特性，请参考 Hottech 官方数据手册或联系供应商以获取完整规格表。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
