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Hottech IRLML6244
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech IRLML6244
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- IRLML6244
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0229946201
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.3W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 700pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRLML6244 产品概述
一、主要参数
- 类型：N沟道场效应管（MOSFET）
- 数量：1个 N沟道
- 漏源耐压 Vdss：20V
- 连续漏极电流 Id：6.3A
- 导通电阻 RDS(on)：21mΩ @ Vgs=4.5V，Id=6.3A
- 功耗 Pd：1.3W（SOT-23 封装，环境及散热有关）
- 阈值电压 Vgs(th)：1.1V
- 栅极总电荷 Qg：8.9nC @ Vgs=4.5V
- 输入电容 Ciss：700pF @ 16V
- 反向传输电容 Crss：98pF @ 16V
- 工作温度范围：-55℃ ~ +150℃
- 品牌：Hottech（合科泰）
- 封装：SOT-23
二、器件简介与特点
IRLML6244 为低压、逻辑电平驱动的 N 沟 MOSFET，RDS(on) 在 4.5V 驱动下可达 21mΩ，适合在 5V 或更高逻辑电平下实现低导通损耗。较小的 Ciss 与中等 Qg 值在中低频开关应用中兼顾了开关速度与驱动要求。SOT-23 小封装适用于空间受限的便携式或消费类电子产品。
三、典型应用
- 低压电源开关、负载开关（高侧需配合驱动）
- DC-DC 变换器与同步整流（中小功率）
- 电池管理、手持设备电源路径选择
- 小电流电机驱动与继电器驱动前级
四、使用注意与 PCB 布局建议
- 虽为逻辑电平型，但在要求最低导通压降时应保证 Vgs≥4.5V；Vgs=2.5V 下导通电阻会显著增加。
- Qg=8.9nC 在高频开关时需考虑驱动器能力与开关损耗，可通过串联栅极电阻与缓冲驱动器优化开关过渡。
- SOT-23 散热受 PCB 铜面积限制，重负载时应增大铜箔、加热孔或散热铜板以降低结温。
- 布局：栅—源回路尽量短且并联去耦，漏极走线加宽以降低压降与散热阻抗。
五、可靠性与封装信息
SOT-23 小尺寸适合自动贴片组装，工作温度覆盖-55℃~+150℃。在靠近额定 Pd 工作时需注意热降额与长期可靠性，建议参考厂商完整数据手册进行热阻与极限参数核算。
六、选型建议与替代
若系统驱动电压受限（如 3.3V），建议验证在该 Vgs 下的 RDS(on) 与功耗；若需更低 RDS(on) 或更高功率处理能力，可考虑更大封装（SOT-223、SO-8）或同类低压 MOSFET 作为替代选型。购买时注意核对 Hottech（合科泰）的完整型号与批次信息。
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