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Hottech BAT54S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Hottech BAT54S
- Type
- HOTTECH
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HOTTECH
- Electronic Component
- BAT54S
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0228550656
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 800mV@100mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54S 产品概述 — Hottech(合科泰)
一、产品简介
BAT54S 是一款小信号肖特基二极管，Hottech（合科泰）生产，采用 SOT-23 表贴封装，双二极管系列结构（两只肖特基二极管串联或按器件标注配置）。器件以低正向压降、快速恢复和较低反向漏电流为特点，适用于低电压、低功耗电子系统中的整流、保护与电平转换等场合。
二、主要电气参数
- 正向压降 Vf：约 800 mV @ 100 mA（典型工作点）
- 直流反向耐压 Vr：30 V（最大额定值）
- 最大整流电流：200 mA（连续）
- 反向电流 Ir：典型 2 μA @ 25 V
- 工作结温范围：-55 ℃ ~ +150 ℃
- 封装：SOT-23（表面贴装）
三、主要特点与优势
- 低正向压降：在 100 mA 量级下 Vf ≈ 800 mV，较普通硅二极管下降优势明显，可降低功耗与热损耗。
- 低反向漏电流：2 μA@25 V 的漏电水平利于电池供电或待机电路，减少静态功耗。
- 小型化封装：SOT-23 适合高密度 PCB 布局，便于自动贴装与回流焊工艺。
- 宽温度范围：支持工业级工作温度，适合多种环境应用。
- 快速响应：肖特基结构固有的快速切换适合高频整流与保护应用。
四、典型应用场景
- 电源反向保护与电源 OR-ing（电源选择）
- 开关电源和降压模块的低压整流与二次侧保护（低到中等电流）
- 信号钳位、夹位电路与电平移位
- 电池供电设备、便携式终端与便携式仪表的低功耗电路
- 高速切换电路中作为快速恢复二极管
五、封装与热管理
SOT-23 封装适合常见 SMT 流程，但由于器件最大连续整流电流为 200 mA，热阻和 PCB 散热能力会直接影响结温。建议在 PCB 设计时：
- 为器件引脚和焊盘提供适当的铜箔面积以增强散热；
- 若长时间接近额定电流，应进行热仿真或实测结温，必要时增加散热区域或降额使用。
六、选型与使用注意事项
- 确认工作电压和反向峰值电压不超过 30 V；对有大反向电压或脉冲应力的场合选择额定更高的器件。
- 对于超过 100 mA 的持续工作，注意 Vf 上升导致的功耗与结温上升，应适当降额或采用并联/其它封装器件。
- 在高温环境或高湿场合，关注封装可靠性与 PCB 防护；焊接时遵循制造商回流曲线以避免封装应力。
- 若需更低的正向压降或更高电流能力，可考虑其他型号或功率级肖特基器件。
总体而言，Hottech 的 BAT54S 在小信号、低压、低功耗场景中提供了可靠的肖特基性能，适合多数便携和工业级电子设计的整流与保护应用。
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