WMSIC Electronic Components

HF HFD4/12-SR HFD4

ModelHFD4/12-SR
PackageSMD,10x6.5mm
BrandHF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HF HFD4 / 12-SR
Type
HF
Minimum package
900 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HF
Electronic Component
HFD4/12-SR
Electronic Component
1
Package
SMD,10x6.5mm
Electronic Component
Signal Relay
Electronic Component
1.752g
Electronic Component
8
Electronic Component
1
Electronic Component
3ms
Electronic Component
BM0228747374
Operating Temperature
40℃~+85℃
Contact Resistor
100mΩ
Coil Voltage
12V
Coil Resistor
1.028kΩ
Coil Type
Coil

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HFD4/12-SR 信号继电器 产品概述

一、产品简介

HFD4/12-SR 是 HF(宏发)出品的一款小型表面贴装(SMD)信号继电器,外形尺寸约 10 × 6.5 mm,8 引脚、两组转换触点(2C,双刀双掷)。适用于要求体积小、低功耗和高信噪比的开关场合,如通信设备、测试测量、仪表和小功率控制线路。

二、主要电气参数

  • 触点形式:两组转换(2C,双刀双掷)
  • 线圈电压:12 V(有极性,单线圈)
  • 线圈功率:140 mW;线圈电阻:1.028 kΩ(线圈电流≈11.7 mA)
  • 触点材料:AgNi + 镀金;接触电阻:≤100 mΩ
  • 触点容量(电阻负载):1 A @ 30 VDC;300 mA @ 125 VAC
  • 最大切换电流:2 A(瞬态或特殊条件)
  • 最大切换电压:250 V AC;220 V DC
  • 动作时间 / 释放时间:约 3 ms / 3 ms
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 引脚数:8

三、主要特性与优势

  • 小体积、SMD 封装,便于高密度 PCB 布局与自动贴装回流焊接;
  • 低线圈功耗(140 mW),适合电池或低功耗系统使用;
  • AgNi+镀金触点,低接触电阻、抗氧化能力好,适合微小信号和开关频繁的场合;
  • 动作/释放时间短(约 3 ms),响应速度快,适合快速切换控制。

四、典型应用场景

  • 通信设备与交换机的线路切换与信号隔离;
  • 测试测量设备的通道切换与故障自检;
  • 精密仪器、医学电子设备的小电流开关;
  • 需要低功耗驱动和空间受限的嵌入式系统。

五、使用建议与注意事项

  • 由于标称“有极性”,安装时请严格按数据手册标注的线圈极性焊接与驱动;若不确定,请向厂方确认极性与内部结构;
  • 线圈驱动:线圈电流约 11.7 mA,单片机 GPIO 直接驱动通常不推荐长期承受该电流,建议用 NPN 晶体管或 N-channel MOSFET 做低端开关;
  • 抑制回路:驱动端应并联吸收元件(二极管、RC 或 TVS),注意二极管会延长释放时间,若需快速释放可选 RC/RCD 或 TVS 组合;
  • 触点使用:标称触点容量针对阻性负载,驱动感性或电容性负载时应降额并采取吸收/限流措施;频繁切换或大电流场合应向厂家确认电气寿命规格;
  • 环境与可靠性:工作温度 -40~+85 ℃,在极端温度、潮湿或污染环境下应考虑封装和防护措施。

六、封装与焊接建议

  • SMD 封装适合回流焊工艺,推荐遵循制造商回流焊温度曲线与焊盘布局;
  • 在 PCB 设计时保留足够的铜面积以利于焊接可靠性,若用于高功率线路,注意热量管理;
  • 贴装前后避免对继电器外壳施加过大机械应力。

七、选型与替代建议

  • 若需更高电流或更高电压能力,可选用同厂或其他品牌的功率型继电器;
  • 若需更快速释放或无需极性限制的型号,可与无极性或带双线圈的继电器比较;
  • 购买与替换时,请核对线圈电压、触点形式、引脚排列与封装尺寸,优先参照原厂完整数据表以保证兼容性。

如需具体电气寿命、典型寿命曲线、推荐 PCB 焊盘尺寸或等效电路图,可提供进一步需求以便查询并给出精确资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.