WMSIC Electronic Components

HTC LM2596DP-5.0

ModelLM2596DP-5.0
PackageSOP-8-EP
BrandHTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HTC LM2596DP-5.0
Type
HTC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HTC
Electronic Component
LM2596DP-5.0
Electronic Component
1
Package
SOP-8-EP
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.132g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0221597564
Operating Temperature
40℃~+125℃
Operating Voltage
40V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:LM2596DP-5.0

一、产品简介

LM2596DP-5.0是一款高效的降压型DC-DC电源转换芯片,具有3A的输出电流能力,适用于输入电压范围为4.5V至40V的各种应用场合。该产品采用SOP-8-EP封装,设计紧凑,适合各种空间有限的电子设备。LM2596DP-5.0的输出电压固定在5.0V,满足许多低电压电子设备的需求,是工业、消费电子及汽车领域等多种应用场景中的理想选择。

二、主要特性

  1. 高效率:LM2596DP-5.0使用了先进的PWM控制技术,转换效率可达90%以上,在较宽的负载范围内保持优异的电性能,有助于减少能量损耗和热量产生。

  2. 输出电流:该芯片能够提供最大3A的输出电流,结合其高效率,适合对电流有较高需求的应用,特别是在需要驱动马达、传感器或其他负载时。

  3. 宽输入电压范围:支持输入电压范围从4.5V到40V,能够适应多种电源条件,无论是在稳定电源供给的电力网络上,还是在汽车电源等波动较大的条件下均能正常工作。

  4. 温度保护与过流保护:产品内置多种保护机制,确保在异常状态下如过温或短路时仍然能够安全工作,这对于保障下游设备和最终用户的安全至关重要。

  5. 简单的外部元件配置:由于设计考量,LM2596DP-5.0仅需要少量的外部元件就能实现稳压功能,使得设计和布线更加简洁,降低了PCB布局的复杂性。

  6. 封装形式:SOP-8-EP封装使得该芯片在热效应管理上具有良好的性能,并且适合自动化生产,简化了焊接过程。

三、应用场景

LM2596DP-5.0广泛应用于各类电子设备中,包括但不限于:

  • 消费电子:如手机充电器、平板电脑等便携式设备。
  • 工业设备:用于供电的控制系统、传感器模块等。
  • 汽车电子:如车载音响、导航设备及其他辅助电源设备。
  • 电源适配器:作为电源管理的核心组件,适应多种输出需求。

四、电路设计指南

在设计使用LM2596DP-5.0的电路时,建议遵循以下原则:

  1. 电容选择:输入和输出电容应选用低ESR电容,以保障良好的稳压性能。
  2. 电感选择:确保选择合适规格的电感,以支持数据手册上建议的额定电流,同时减小电源纹波。
  3. 散热设计:根据所选负载和环境条件,评估散热需求,考虑加装散热器以保持芯片在安全温度范围内工作。
  4. PCB布局:注意布局设计,确保降低电磁干扰(EMI),尽量将反馈网络接近于控制引脚。

五、总结

LM2596DP-5.0是一款功能强大、应用广泛的DC-DC降压电源转换芯片,其高效的电源转换能力、温度和过流保护特性,使得它成为现代电子设备中的关键组件。对于设计工程师而言,LM2596DP-5.0不但能够满足不同应用需求,还能够有效提升电源系统的可靠性和稳定性。选用LM2596DP-5.0,不仅能够提高产品的整机性能,更能节省成本、缩短开发周期,助力于更快地推向市场。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.