WMSIC Electronic Components

HTC 74HC14D

Model74HC14D
Package14-SOIC
BrandHTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HTC 74HC14D
Type
HTC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HTC
Electronic Component
74HC14D
Electronic Component
1
Package
14-SOIC
Electronic Component
Inverter
Electronic Component
74HC
Electronic Component
0.204g
Electronic Component
1
Channel Count
6
Features
Electronic Component
Electronic Component
BM0265129331
Operating Temperature
40℃~+85℃
Operating Voltage
2V~6V
Type
Flip-Flop
Current(IOH)
4mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:74HC14D 施密特触发器反相器

概述

74HC14D 是一款高电平兼容的 CMOS 施密特触发器反相器。这款器件是基于74系列逻辑元件的进一步发展,提供低功耗和高速度,广泛应用于各种逻辑电路设计和信号处理应用中。它具有 6 个独立的反相器,每个反相器都集成了施密特触发器特性,能够有效地提高输入信号的抗干扰能力和输出信号的稳健性。

主要特性

74HC14D 的主要特性包括:

  • 逻辑类型:反相器(NOT门),可实现输入信号的反向输出。
  • 电路数:包含 6 个逻辑电路,可同时处理多个信号,增加了电路设计的灵活性。
  • 施密特触发器特性:具有施密特触发器的输入级设计,能够产生明确的变化阈值,从而消除输入信号的抖动,提升信号处理的稳定性。
  • 供电电压范围:能够在 2V 至 6V 的供电电压下正常工作,适应多种不同的电源需求。
  • 低静态电流:最大静态电流仅为 1µA,极大地降低了功耗,适合电池供电的应用。
  • 输出电流能力:能够提供高达 5.2mA 的输出电流,保证驱动能力,适合连接负载。
  • 逻辑电平界限:低逻辑电平范围为 0.3V 至 1.5V,高逻辑电平范围为 1.5V 至 4.2V,确保在各种工作环境中可靠识别并响应信号。
  • 传播延迟:在 6V 供电和 50pF 负载条件下,最大传播延迟为 21ns,适合高速数字电路设计。
  • 工作温度范围:适应环境温度从 -40°C 到 125°C,适合恶劣环境下的应用,保证稳定运行。

应用场景

74HC14D 被广泛应用于各种电子和电气系统中,包括但不限于以下领域:

  1. 信号整形:由施密特触发器的特性,74HC14D 可用于加强脆弱的数字信号,去除噪声。
  2. 逻辑电路:可以用作基本的逻辑反相器,构建更复杂的逻辑功能模块。
  3. 脉冲生成:因其响应速度快,可用于生成时钟信号和脉冲信号。
  4. 数据传输接口:适用于数据通信和接口通信中信号稳定性要求高的地方。
  5. 嵌入式系统:在各种嵌入式设备中,负责数据的处理和状态指示。

封装与安装

74HC14D 采用 14-SOIC 封装,尺寸为 0.154"(3.90mm 宽),适合表面贴装型安装,便于集成在现代电路板设计中。SOIC 封装的设计确保了良好的电气特性和热管理性能,符合当前的微型化和高集成度需求。

结论

综上所述,74HC14D 是一款性能优越、适应性强的逻辑元件,广泛应用于各种数字电路的设计中。其低功耗、高速、宽电压范围和温度韧性使其成为现代电子设计不可或缺的元件之一。无论是在消费电子、工业控制还是自动化设备中,74HC14D 都能够为系统提供可靠的信号处理和逻辑控制解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.