WMSIC Electronic Components

HTC LM2576R-5.0

ModelLM2576R-5.0
PackageTO-263-5
BrandHTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HTC LM2576R-5.0
Type
HTC
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HTC
Electronic Component
LM2576R-5.0
Electronic Component
1
Package
TO-263-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0g
Electronic Component
1
Type
Electronic Component
Electronic Component
BM69415676
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
8V~40V
Switching Frequency
52kHz
Electronic Component
Electronic Component
Output Voltage
5V
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2576R-5.0 产品概述

1. 产品简介

LM2576R-5.0是一款高效的降压型DC-DC稳压器,属于LM2576系列中的一员,广泛应用于各种电源管理任务。作为一款内置电源转换器,它能有效地将高电压(例如12V、24V甚至更高)转换为稳定的5V输出,具有高效能和优良的电源调节特性。LM2576R-5.0采用TO-263-5封装,使其在散热和空间利用上表现出色,是电子设备和系统中非常理想的选择。

2. 主要特性

  • 输出电压:LM2576R-5.0提供稳定的5V输出,适用于各种低功耗设备。
  • 最大输出电流:此芯片能够提供高达3A的输出电流,满足大多数电源需求。
  • 高效率:在常见的负载情况下,效率可高达75%至90%不等,显著减小了热量的产生,从而改善了系统的整体可靠性。
  • 内置保护功能:LM2576的设计包括过流保护、过热保护和欠压锁定等功能,确保在极限条件下也能可靠运行。
  • 简化的外部组件:该芯片所需的外部组件较少,通常仅需电感和几个电容器,就可组成一个完整的降压电源电路,从而降低了设计和制造成本。

3. 应用场景

LM2576R-5.0由于其优秀的性能和稳定的输出,广泛应用于多种场合:

  • 消费电子产品:如音响设备、电视机、游戏机等需要稳定5V电源的电器。
  • 工业控制系统:可用于工业自动化设备、电机驱动等场景,提供稳定的控制电源。
  • 便携式设备:在移动设备中,LM2576能有效地延长使用时间,避免因为电源供电不稳定导致的故障。
  • LED驱动:可以作为LED灯条的电源,为其提供稳定的驱动电压。

4. 电气特性

  • 输入电压范围:支持从7V到40V的输入电压,这为多种应用场合提供了灵活性。
  • 输出电压精度:LM2576R-5.0输出电压的典型精度为±4%,确保了负载的稳定性。
  • 工作温度范围:芯片的工作温度范围为-40°C到+125°C,适合在恶劣的环境条件下工作。

5. 散热与封装

LM2576R-5.0采用TO-263-5封装,这种封装不仅有助于热量迅速散发,还具有较小的占板面积,方便集成进各类电路板中。较大的接触面积有助于提高散热性能,适合在发热量较大的应用中进行使用。

6. 设计考虑

为了实现最佳性能,设计时需要注意以下几点:

  • 元器件选择:选用合适的电感和电容,以确保降压转换过程中的性能。
  • PCB布线:良好的布局和布线对减少电磁干扰至关重要,应尽量缩短高电流路径。
  • 散热设计:在高负载情况下,需要充分考虑散热问题,可以通过增加散热片或改进空气流通来实现。

7. 结论

LM2576R-5.0是一款功能强大且易于使用的降压型DC-DC电源芯片,适合各种现代电子设备和系统。凭借其出色的电气特性、高效率及多样化的应用场景,LM2576R-5.0无疑是在电源设计中一个理想的选择。选择LM2576R-5.0,不仅可以提高产品的整体性能,还能在设计和制造过程中降低成本,同时确保系统的稳定性和可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.