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HTC LM78L10F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HTC LM78L10F
- Type
- HTC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 1.7V
- Electronic Component
- HTC
- Electronic Component
- 62uV
- Electronic Component
- LM78L10F
- Electronic Component
- 1
- Package
- SOT-89-3
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 1.81g
- Electronic Component
- 1
- Electronic Component
- BM0230009536
- Operating Temperature
- 40℃~+125℃@(Tj)
- Operating Voltage
- 25V
- Output
- Electronic Component
- Output Voltage
- 10V
- Output Current
- 100mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM78L10F 产品概述
一、主要规格概览
LM78L10F（HTC品牌）是一款固定输出为正10V的线性低压差稳压器（LDO），单通道输出，最大输出电流100mA，允许最高工作电压25V。典型压差（dropout）约为1.7V，电源纹波抑制比（PSRR）在120Hz时约为44dB，输出噪声约62µV。器件在封装为SOT-89-3下工作，结温范围可达-40℃至+125℃（Tj）。器件集成短路保护、过流保护与过热保护三重保护机制，可靠性优良。
二、关键特性与优势
- 固定10V输出、单通道设计，便于在需要稳定10V参考或偏置的系统中直接使用。
- 100mA额定电流满足低功耗模拟电路、传感器电源及小型逻辑外围供电需求。
- 低压差（1.7V）提高在低压差工况下的可用性，但仍需保证输入电压高于Vout+Vdrop以维持稳压。
- PSRR 44dB（120Hz）与62µV低噪声，有利于对噪声敏感的信号链（如放大器前端、ADC参考）稳定供电。
- 内置短路/过流/过热保护，提升系统容错性并简化外围保护设计。
三、热管理与电源设计注意事项
线性稳压器的功率耗散等于(Vin−Vout)×Iout。若输入接近器件最大工作电压（例如25V）并在100mA输出时，器件功耗可达约1.5W，这对SOT-89封装来说热负荷较大，容易触发过热保护。建议：
- 尽量使Vin与Vout之间的压差最小化以降低功耗（例如在12V输入时功耗仅约0.2W）。
- 在PCB上为SOT-89增加散热铜箔面积并使用多层接地/电源平面与热过孔，以降低结到环境热阻。
- 关键热参数与布局要求请参见厂商器件数据手册并按推荐布局实现。
四、外部元件与布局建议
- 输入端建议并联高频旁路电容（如0.1µF陶瓷）与适量电解或钽电容（1µF–10µF）作为去耦与储能，以应对瞬态负载。
- 输出端通常需要低ESR电容（1µF–10µF陶瓷或钽）以确保环路稳定性和低噪声输出；具体容值与等效串联电阻请以数据手册稳定性要求为准。
- 将输入、输出旁路电容尽量靠近LDO管脚放置，缩短走线并保证良好接地回流路径，减少纹波与干扰耦合。
- SOT-89-3常见的顶部/底部管脚排列为输入、接地、输出的顺序（实际管脚请以HTC数据表为准）；布线前务必核对器件管脚定义。
五、典型应用场景
- 仪器仪表的10V偏置/参考电源。
- 低噪声模拟前端与数据采集系统的供电。
- 工业控制、电池监测与便携设备中对中低电流稳定电源的需求。
- 作为较大电源轨的本地降压稳压器，为小型模块或传感器提供隔离供电。
结语：LM78L10F以其固定10V输出、低噪声与完整的保护功能适合多类对稳定性和可靠性有要求的低功耗应用。使用时请重点关注输入—输出压差与功耗带来的热管理问题，并严格按照HTC提供的数据手册和参考电路进行外部去耦与PCB热设计，以保证长期稳定运行。
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