WMSIC Electronic Components

HTC LM2596DP-ADJ

ModelLM2596DP-ADJ
PackageSOP-8-PP
BrandHTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HTC LM2596DP-ADJ
Type
HTC
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HTC
Electronic Component
LM2596DP-ADJ
Electronic Component
1
Package
SOP-8-PP
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.25g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0226261107
Operating Temperature
40℃~+125℃
Operating Voltage
40V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2596DP-ADJ 产品概述

一、产品简介

LM2596DP-ADJ 是一款常用的降压(Buck)型开关稳压器,输出可调,适用于从中等到高电压输入向单路输出稳压电源的设计。该器件内置功率开关管,工作频率约150kHz,最大输出电流可达3A,适合为各种嵌入式、工业及通信设备提供高效电源转换。

二、主要技术参数

  • 输出类型:可调(ADJ 可调型)
  • 输入电压范围:4.5V ~ 40V(典型工作至 40V)
  • 输出电流:最大 3A(需良好散热)
  • 参考电压(Vref):典型 1.23V,参考公差范围约 1.127V ~ 1.243V
  • 输出电压可调范围:约 1.23V ~ 37V(受输入电压及外围元件限制)
  • 拓扑结构:降压(非同步整流)
  • 开关频率:约 150kHz
  • 静态电流(Iq):约 5mA(无负载时待机电流)
  • 开关管:内置功率开关
  • 环境温度范围:-40℃ ~ +125℃
  • 封装:SOP-8-PP(散热需考虑)

三、功能与特性

  • 内置功率开关,简化外部功率器件选型与布局。
  • 可调输出,利用外部分压电阻实现宽范围电压设置。
  • 非同步整流结构,电路简单但要求外接肖特基二极管以承受整流电流与反向恢复。
  • 工作频率较低(150kHz),有利于减小开关损耗和电磁干扰(相对更高频率设计),但外围电感体积可能略大。
  • 低静态电流(约5mA),适用于对空载损耗有一定要求的场合。

四、典型应用场景

  • 工业控制及仪器仪表电源模块
  • 通信设备的局部电源降压转换
  • 汽车电子(满足-40℃~+125℃环境)在非严格同步整流要求下的电源设计
  • 开关电源模块、工控板载电源

五、选型与设计注意事项

  • 散热:在接近3A输出时,芯片温升显著,需在PCB上设计散热铜箔并考虑散热片或改用更大封装/并联方案。
  • 二极管选型:必须配合低正向压降、低恢复时间的肖特基二极管,且额定电流及反向电压需满足最大输入与输出条件。
  • 电感与电容:选择适合的电感(满足电流不饱和、低直流电阻)和低ESR输出电容以保证稳定性与低纹波。
  • EMI 与布局:输入电容靠近芯片输入端,回流路径短而宽,开关节点走线尽量短,地平面完整以降低辐射与干扰。
  • 输入电压与输出差:确保输入电压高于设定输出电压加上必要的开关损耗余量,避免掉出稳压区。

六、封装与环境

SOP-8-PP 封装适合常规电路板装配,工作温度范围覆盖-40℃~+125℃,适用于多数工业及消费级场景。高功率工况下需关注封装热阻并通过PCB散热优化来保证长期可靠性。

七、典型外围电路与计算示例

输出电压由外部分压决定:Vout = Vref × (1 + R2/R1)(忽略调整引脚电流误差时)。
示例:若设定 Vout = 5.0V,取 R1 = 1kΩ,则 R2 ≈ (5.0/1.23 - 1) × 1kΩ ≈ 3.06kΩ(可取标准阻值3.0k或3.03k并做微调)。
常见配套:输入滤波电容(低ESR)、输出电解或固态电容(低ESR)、合适电感与肖特基二极管。建议参考参考设计与样板电路对关键元件和布局做最终确认。

备注:以上参数与设计建议基于 LM2596 类别器件的一般特性及您提供规格整理。实际设计请以器件数据手册与实验验证为准,并根据工作工况做好热设计与EMI控制。

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