WMSIC Electronic Components

HTC LM1117GS-1.8

ModelLM1117GS-1.8
PackageSOT-223-3L
BrandHTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HTC LM1117GS-1.8
Type
HTC
Minimum package
2500

Technical parameters

Electronic Component
1.3V@(1A)
Electronic Component
HTC
Electronic Component
100uV
Electronic Component
LM1117GS-1.8
Electronic Component
1
Package
SOT-223-3L
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.25g
Electronic Component
1
Electronic Component
BM0231131100
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
12V
Output
Electronic Component
Output Voltage
1.8V
Output Current
1A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM1117GS-1.8 产品概述

一、主要参数

LM1117GS-1.8 为固定输出线性稳压器(LDO),输入工作电压为 12V,输出电压 1.8V,最大输出电流 1A。主要电气参数包括:电源纹波抑制比(PSRR)75dB@120Hz,输出噪声约 100µV,压差(dropout)1.3V@1A。器件为单路正输出,工作结温范围 -40℃ ~ +125℃(Tj)。具备过热保护与过流保护,提升系统可靠性。

二、关键特性与优势

  • 高 PSRR(75dB@120Hz):对交流电源纹波具有良好抑制能力,适合对噪声敏感的模拟或射频前端供电。
  • 低输出噪声(约100µV):适合精密模数转换器、基带处理器等场合。
  • 内建保护功能:过热(OTP)与过流(OCP)保护在异常工况下有效限制器件损坏并实现自动恢复。
  • 简单易用:固定输出、单通道设计便于快速集成于常见电源方案。

三、典型应用场景

适用于便携设备、工业控制、通信终端、单片机和 DSP 核心电源、模拟信号链和传感器供电等需要稳定 1.8V 低压电源的场合。

四、热设计与功耗考虑

在最大工作点(Vin=12V,Iout=1A)时,器件功耗 Pd ≈ (12V − 1.8V) × 1A = 10.2W。此功耗非常高,必须重视散热设计:建议使用合适散热片、加大 PCB 铜箔面积(热过孔连接至散热层)、并评估结温以确保 Tj ≤ +125℃。对于持续高电流工作,应考虑采用降压转换器前级降压或将输入电压降低以减少直流功耗。

五、布局与外围元件建议

  • 输入侧:在器件输入引脚附近放置 10µF(或更大)低等效串联电阻(ESR)电容,减少输入阻抗并提高瞬态响应。
  • 输出侧:LM1117 系列对输出电容稳定性敏感,推荐使用 10µF 以上的低 ESR 电容(钽电容或专用陶瓷加串联电阻的组合),并靠近输出引脚摆放。
  • 布线:输入、输出和地线应尽量短且宽,地线采取单点回流或短路径回流,避免噪声耦合到敏感电路。
  • 保护:若系统允许,可在输入端增加熔断器或热熔断元件,在输出端加上限流或软启动电路优化启动行为。

六、选型建议与注意事项

  • 若系统持续输出大电流且输入–输出压差较大,优先考虑采用开关降压模块以降低器件发热和整体系统损耗。
  • 在高温或受限散热条件下,应做热仿真并保证器件在最坏工况下不会进入热关断循环。
  • 确认所选封装的热阻、PCB 散热能力与实际机械安装方式匹配负载需求。
  • 推荐在样机阶段验证纹波、噪声和瞬态响应,确保满足下游电路的电源品质要求。

总结:LM1117GS-1.8 提供稳定、低噪声的 1.8V 输出和可靠的保护功能,适合需高电源品质的低压数字与模拟电路,但在高 Vin 与大电流条件下必须特别重视散热与功耗管理。

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