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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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LM2596HVGR-5.0 是一种高性能、降压型 DC-DC 电源芯片, 由 HTC 品牌生产。该芯片以其高效率、稳定输出和广泛的输入电压范围而受到广泛欢迎,特别适用于各种电源应用,包括工业设备、汽车电子、通信设备和消费电子产品。
LM2596HVGR-5.0 采用 TO-263-5 封装,这是一种常见的五引脚封装,适合于高功率应用。这种封装设计可以有效地散热,确保芯片在高负载条件下保持稳定运行。
LM2596HVGR-5.0 具有高效率的设计,能够在广泛的输入电压范围内提供高效的能量转换。这意味着在实际应用中,可以减少热量产生,提高系统的整体效率和可靠性。
该芯片支持 4.5V ~ 60V 的输入电压范围,这使得它非常适合于各种不同的电源输入条件。无论是从电池、适配器还是其他不稳定的电源输入,LM2596HVGR-5.0 都能提供稳定的输出。
LM2596HVGR-5.0 提供了精确的输出电压调节,输出电压范围为 4.825V ~ 5.2V。这确保了在各种负载条件下,输出电压保持稳定,不会出现显著的波动。
该芯片能够提供高达 3A 的输出电流,这使得它适用于需要较高功率的应用场景,如驱动大型负载、供电高性能设备等。
在待机或低负载状态下,LM2596HVGR-5.0 的静态电流仅为 8mA。这对于节能和延长电池寿命的应用来说是非常重要的。
支持 -40℃ ~ +125℃ 的工作温度范围,使得 LM2596HVGR-5.0 可以在极端环境中运行,例如汽车电子系统、工业控制系统等。
LM2596HVGR-5.0 适用于工业控制系统、机器人、传感器网络等,提供稳定可靠的电源解决方案。
由于其宽输入电压范围和高工作温度,LM2596HVGR-5.0 非常适合用于汽车电子系统,如导航系统、娱乐系统和安全设备。
在通信设备中,如基站、路由器和交换机,LM2596HVGR-5.0 可以提供高效、稳定的电源供应。
对于消费电子产品,如笔记本电脑、平板电脑和智能手机的充电器,LM2596HVGR-5.0 提供了高效能量转换和稳定输出。
在设计时,需要注意以下几点:
LM2596HVGR-5.0 是一种功能强大、性能优异的降压型 DC-DC 电源芯片。其广泛的输入电压范围、稳定输出、低静态电流和高效率,使其成为各种电源应用中的理想选择。通过合理的设计和布局,可以充分发挥出该芯片的优势,实现高可靠性和高效率的电源系统。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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