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HTC LM78L09F
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HTC LM78L09F
- Type
- HTC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 1.7V@(40mA)
- Electronic Component
- HTC
- Electronic Component
- 58uV
- Electronic Component
- LM78L09F
- Electronic Component
- 1
- Package
- SOT-89
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 1.855g
- Electronic Component
- 1
- Electronic Component
- BM0265822726
- Operating Temperature
- 40℃~+125℃@(Tj)
- Operating Voltage
- 24V
- Output
- Electronic Component
- Output Voltage
- 9V
- Output Current
- 100mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM78L09F 产品概述
一、概述
LM78L09F 是一款固定输出的线性稳压器，提供稳定的正向9V输出，单通道设计，采用 SOT-89 封装，适用于中低功率的嵌入式与模拟电路电源管理。器件内置过热保护与过流保护，提升了系统的可靠性与抗故障能力。
二、主要参数（要点）
- 输出电压：9V（固定）
- 输出电流：最大 100mA
- 工作电压：最高 24V
- 压差（Dropout）：1.7V @ 40mA
- 静态电流（Iq）：4.1mA
- 噪声：58 μV
- PSRR：38 dB @ 120 Hz
- 工作结温：-40℃ ~ +125℃（Tj）
- 保护功能：过热保护、过流保护
- 封装：SOT-89（单通道）
三、性能与特点
- 低噪声与良好抑制：58 μV 的输出噪声和 38 dB @120Hz 的 PSRR，使其适合对电源噪声敏感的模拟放大、传感器前端与音频偏置电源。
- 保护功能：内置过热与过流保护，可在异常工况下限制电流或进入热关断，保护芯片与外围负载。
- 适用温度范围宽：支持 -40℃ 到 +125℃ 的结温，适合工业与商用环境。
- SOT-89 小型封装，便于空间受限电路板布局，但散热能力受限，需合理热设计。
四、典型应用场景
- 仪表与传感器偏置电源
- 小功率音频偏置与模拟电路
- 单片机及外围器件的 9V 供电（需注意转换关系）
- 工业控制模块、通信设备的辅助电源
五、使用建议与热设计
- 输入电压需高于 Vout + 压差，建议最小输入约 11V（视负载而定），最大不要超过 24V。
- 功耗估算：Pd ≈ (Vin - 9V) × Iout + Iq × Vin。举例：Vin=24V、Iout=100mA 时，Pd ≈ (24-9)×0.1 ≈ 1.5W（忽略静态功耗），在 SOT-89 封装下热量集中，需增加铜箔面积或外接散热措施以避免过热关断。
- 电容与稳定性：为保证瞬态响应与稳定性，建议在输入端并联去耦电容（例如 0.33 μF ~ 1 μF），输出端并联 0.1 μF~10 μF 的低 ESR 电容。具体值可根据负载瞬态需求调整。
- 布局建议：输入电容靠近输入引脚布局，输出走线尽量粗短，扩大接地回流铜箔以降低热阻并提升散热。
六、注意事项
- 在高 Vin 与高 Iout 条件下，热耗大，需要做热仿真或实测温升，确保结温不超过 125℃。
- 封装限制输出电流，长期满载工作需确保良好散热并考虑余量。
- 当用于模拟/音频系统时，可结合额外滤波降低纹波和输出噪声。
七、小结
LM78L09F 是一款性能均衡、带有保护功能的固定 9V 线性稳压器，适合对噪声与抑制能力有一定要求且功率较小的应用场景。采用 SOT-89 封装有利于尺寸受限设计，但需针对热管理采取相应措施，以发挥器件的可靠性与长期稳定性。
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