WMSIC Electronic Components

HTC NE555N

ModelNE555N
PackageDIP-8
BrandHTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HTC NE555N
Type
HTC
Minimum package
50 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HTC
Electronic Component
NE555N
Electronic Component
1
Package
DIP-8
Electronic Component
555 Timer
Electronic Component
0.764g
Electronic Component
1
Features
positions
Electronic Component
BM0116143300
Electronic Component
1
Operating Temperature
20℃~+70℃
Operating Voltage
2V~18V
Operating Current
200uA
Electronic Component
Electronic Component
Electronic Component
50

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NE555N定时器/计时器产品概述

一、产品基本信息

NE555N是HTC品牌推出的单通道定时器/计时器,采用DIP-8双列直插式封装,属于经典555系列模拟集成电路范畴。该芯片核心功能为定时、脉冲生成、波形整形,凭借高兼容性、低功耗等特点,广泛应用于消费电子、小型设备电路设计,是电子工程师常用的基础元器件之一。

二、核心参数详解

NE555N的参数覆盖电源、功耗、温度等关键维度,具体如下:

  1. 电源范围:支持2V~18V宽电压输入,兼容干电池、5V/12V直流电源等多种供电方式,无需额外电源转换;
  2. 功耗表现:静态工作电流约200uA,低功耗特性适合电池供电的便携设备(如小型定时闹钟);
  3. 温度适应性:工作温度范围为**-20℃~+70℃**,满足民用级场景(室内电子设备、户外非极端环境);
  4. 定时通道:单通道定时设计,通过外围阻容元件可灵活调整时长(经典公式:( T=1.1 \times R \times C ),( R )为定时电阻、( C )为定时电容);
  5. 输出能力:典型输出电流(灌/拉)约200mA,可直接驱动LED、小型继电器,无需额外驱动电路。

三、DIP-8封装与引脚功能

NE555N的DIP-8引脚定义清晰,便于焊接调试:

  • 1脚(GND):电源地,需可靠接地;
  • 2脚(TRIG):触发端,低电平(<VCC/3)触发定时,输出转为高电平;
  • 3脚(OUT):信号输出端,定时期间输出高电平,结束后转低电平;
  • 4脚(RESET):复位端,低电平有效(通常接VCC保持工作,强制复位时接低电平);
  • 5脚(CONTROL):控制端,外接0.01uF电容稳定内部阈值,无需调整可悬空;
  • 6脚(THRESH):阈值端,电容电压升至2VCC/3时,定时结束输出转低;
  • 7脚(DISCH):放电端,内部放电管导通时为定时电容提供放电回路;
  • 8脚(VCC):电源正端,接入2V~18V直流电压。

四、典型应用场景

NE555N的灵活性适配多种基础电路,典型应用包括:

  1. LED闪烁电路:阻容设置闪烁频率,3脚输出方波驱动LED交替亮灭(玩具、装饰灯常用);
  2. 按键防抖电路:作为单稳态触发器,按下按键触发100ms左右定时,避免抖动误触发;
  3. 波形整形电路:作为施密特触发器,将传感器波动信号转换为方波,便于数字电路处理;
  4. 定时开关电路:定时结束后电平变化,控制继电器断开/闭合(如小型风扇定时关闭);
  5. 简单PWM电路:调整阻容参数输出不同占空比脉冲,用于LED调光、小型电机调速。

五、优势与适用限制

5.1 核心优势

  • 宽电压兼容:2V~18V输入,适配多种电源场景,降低设计复杂度;
  • 低功耗便携:200uA静态电流,适合电池供电设备,延长续航;
  • 高输出能力:200mA输出电流,直接驱动负载,减少额外电路;
  • 兼容性强:引脚与所有555系列一致,便于替换升级;
  • 成本低廉:性价比高,适合批量应用于消费电子。

5.2 适用限制

  • 温度范围有限:-20℃~+70℃为普通民用级,不适合工业极端温度(如-40℃低温、85℃以上高温);
  • 精度依赖外围元件:定时精度受阻容精度影响,高精度需选1%以上元件;
  • 非轨到轨输出:输出高电平略低于VCC(如5V电源时约3.3V),部分数字电路需电平匹配;
  • 单通道设计:仅支持单通道定时,多通道需并联芯片或用NE556(双555)。

总结

NE555N作为经典555系列的DIP封装版本,以宽电压、低功耗、高兼容性为核心,覆盖消费电子、小型设备的绝大多数定时需求。其简单的外围电路与可靠性能,使其成为电子设计入门与实用电路的常用选择,适合快速实现基础定时功能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.