Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品简介
74HC04D 是一款高性能的 CMOS 反相器,由 HTC 生产。它采用了 14-SOIC 表面贴装封装,并设计用于提供低静态电流和高速逻辑运算。作为六个独立的反相器,它能够在广泛的供电电压范围内(2V ~ 6V)工作,适用于多种电子电路的设计与应用。
主要特点
逻辑类型:此器件属于反相器逻辑类型,能够将输入信号的逻辑状态反转。例如,如果输入为高电平,则输出为低电平,反之亦然。这种特性使得 74HC04D 在数字电路中极为重要,尤其是在信号处理和逻辑组合中的应用。
电流特性:该器件具有非常低的静态电流消耗,最大值仅为 1µA。这使得它非常适合于对功耗敏感的应用。在高电平和低电平输出状态下,其输出电流均为 5.2mA,能够驱动大多数外围设备。
逻辑电平范围:74HC04D 的逻辑电平在高电压区间为 1.5V ~ 4.2V,低电压区间为 0.5V ~ 1.8V。这使得它能够与多种逻辑电平兼容,适配现代电子设备的需求。
传播延迟:在最大电源电压 6V 和负载电容 50pF 时,74HC04D 的最大传播延迟为 13ns。这种较快的响应时间使其适用于高速数字电路,能够确保信号处理的实时性。
工作温度范围:器件能够在 -40°C 到 125°C 的工作环境下稳定运行,适合于各种苛刻条件下的应用,如工业设备和汽车电子。
封装特性:采用 14-SOIC 封装,器件尺寸为 0.154"(3.90mm 宽),这种紧凑的表面贴装型设计非常适合空间有限的电路板设计,且便于自动化生产。
应用领域
74HC04D 广泛应用于以下几个领域:
设计注意事项
在设计中使用 74HC04D 时,需要考虑以下几个方面:
结论
74HC04D 是一款高度集成的高性能反相器,尤其适用于需要低功耗和高速逻辑操作的应用场景。凭借其广泛的电压范围、低功耗特性以及优越的环境适应能力,74HC04D 适合于多种现代电子设备的设计和应用,是电子工程师不可或缺的设计工具之一。无论是在消费电子、工业控制还是汽车电子领域,它都能够提供理想的性能表现。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products