Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HTC LM386N
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HTC LM386N
- Type
- HTC
- Minimum package
- 50 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HTC
- Electronic Component
- LM386N
- Electronic Component
- 1
- Package
- DIP-8
- Electronic Component
- Audio Power Amplifier
- Electronic Component
- 0.829g
- Electronic Component
- 1
- Features
- ESD
- Electronic Component
- BM0221031380
- Operating Temperature
- 0℃~+70℃
- Operating Voltage
- 4V~12V
- Output Power
- 325mWx1@8Ω；700mWx1@8Ω
- Static Current(Iq)
- 4mA
- Speaker Channel Count
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM386N 产品概述
概述
LM386N是一款低功耗音频功放集成电路(Circuit)、广泛应用于各种音响和音频处理应用中，由美国德州仪器公司 (Texas Instruments) 生产。该芯片在DIP-8封装中集成了多种功能，适合各种便携式音频设备、声卡、紧凑型扬声器等应用场合。LM386N因其优良的性能和友好的设计特性，使其成为了音频设计工程师和电子爱好者的首选元器件。
主要特性
- 功放特性：LM386N能够提供最大1瓦特的输出功率，适用于8Ω扬声器，合适用于小型音频放大项目。
- 增益控制：内置的增益级可以通过外置电阻和电容进行设置，增益范围为20到200，工程师可以依据设计需求自由调节。
- 电源电压范围：支持在4V到12V的电源电压下工作，特别适合于电池供电的便携式设备。
- 低功耗：LM386N在工作时的功耗很低，能够有效延长电池寿命，适合集成在移动设备中。
- 过载保护：具有短路保护和热保护功能，有效延长了芯片的使用寿命并提高了系统的可靠性。
应用场景
LM386N广泛应用于各种音频放大和信号处理设备中，包括但不限于以下几个方面：
- 便携式音频播放设备：如便携式音乐播放器、蓝牙音箱等。
- 二次开发板和DIY项目：许多教育和开发板项目中都采用LM386N作为音频放大器，方便学生和爱好者学习音频放大的基本原理。
- 家用音频系统：如小型家用影院或音响系统中作为音频信号的前端放大器。
- 无线音频设备：如无线麦克风系统，以便在无线传输时增强音质。
电气特性
LM386N的工作电源电压范围较宽，使其在多种电源适配中依然表现良好。在常见的使用情况下，其典型增益为200，输出信号能够成功驱动多种低阻抗负载。以下是部分电气特性：
- 输出功率：最大1W（在Vcc = 12V时，负载为8Ω条件下）。
- 最大工作电流：约为1.3A。
- 输出失真：在正常工作状态下，失真度较小，优于0.1%。
封装信息
LM386N采用DIP-8封装，具有多种便利性：
- 易于焊接：适合手工焊接以及自动化生产，常用于各种PCB（印刷电路板）中。
- 紧凑性：小巧的封装易于集成在空间有限的设备中，同时不占用过多的布线空间。
总结
LM386N作为一款经典的低功耗音频放大器，其在音频领域的应用场景广泛且多样。通过合理的设计与增益调节，LM386N可以轻松满足不同用户的需求。其粘贴、低功耗、可靠性高等优点，使其在电子元器件选择中竞争力十足，适用于从业余爱好到专业音频设备等不同层次的市场需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
