WMSIC Electronic Components

HOLTEK HT66F004

ModelHT66F004
PackageSOP-16-150mil
BrandHOLTEK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HOLTEK(Holtek / Holtek) HT66F004
Type
HOLTEK
Minimum package
50 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HOLTEK(Holtek / Holtek)
Electronic Component
HT66F004
Electronic Component
1
Package
SOP-16-150mil
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.259g
CPU
Other
I / O
18
Electronic Component
1
ADC
12bit
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose; positions(NRST)
Electronic Component
BM0264336522
Operating Voltage
2.2V~5.5V
Electronic Component
Electronic Component
Electronic Component
50

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

合泰HT66F004 8位单片机产品概述

HT66F004是台湾合泰半导体(HOLTEK)推出的一款低功耗、小体积8位RISC架构单片机,专为入门级嵌入式应用设计,兼顾成本控制与功能实用性,广泛适配消费电子、智能家居、小型工业控制等场景。

一、核心架构与运算性能

HT66F004采用合泰自主研发的eFlash RISC精简指令集内核,具备以下核心特性:

  • 指令效率:单周期指令执行(分支指令除外),共约50条简洁指令,代码密度高,运算速度快;
  • 宽电压兼容:工作电压范围覆盖2.2V~5.5V,可直接适配干电池(2节AA电池3V)、USB 5V、线性电源等多种供电方式;
  • 抗干扰设计:内置RC振荡器(无需外部晶振),减少外围元件,同时降低电磁干扰风险,提升系统稳定性。

二、存储资源配置

存储资源针对小型应用优化,平衡成本与功能需求:

  • 程序存储器:2KB Flash闪存,支持在线编程(ICP)与在线调试(ICD),固件可重复擦写(擦写次数≥10万次),数据保持时间≥10年,便于批量生产与后期升级;
  • 数据存储器:96Byte SRAM静态随机存取存储器,用于临时数据缓存(变量、中断堆栈),满足小型程序的运算需求;
  • 存储结构:Flash与SRAM分离设计,Flash掉电不丢失数据,SRAM掉电清零,适配不同数据存储场景。

三、接口与外设功能

内置丰富外设,覆盖基础控制与信号采集需求:

  • 通用I/O口:18个双向I/O引脚,支持软件配置上拉/下拉电阻,部分引脚可复用为ADC输入、定时器输出;
  • 模数转换(ADC):12位SAR逐次逼近型ADC,具备多通道模拟输入(典型8通道),转换精度高,可用于温湿度、光强等传感器信号采集;
  • 定时器/计数器:2个8位定时器(Timer0/Timer1),支持定时中断、PWM输出(用于LED亮度调节、微型电机控制);
  • 看门狗定时器(WDT):独立看门狗,可软件使能/配置,防止程序因干扰跑飞,提升系统可靠性。

四、封装与工作特性

封装与工作参数适配紧凑设计需求:

  • 封装类型:SOP-16(150mil封装尺寸),引脚间距1.27mm,体积小巧(约4.9mm×3.9mm),适合PCB空间有限的应用;
  • 工作温度:商业级0℃70℃(标准),工业级-40℃85℃(可选),适应不同环境温度;
  • 低功耗模式:支持空闲模式(CPU休眠,外设运行)、休眠模式(全系统休眠),待机电流低至μA级,适合电池供电的便携式设备。

五、典型应用场景

HT66F004因成本低、功能实用,广泛用于以下场景:

  • 消费电子:LED小夜灯(亮度调节)、电子玩具(按键控制)、小型闹钟(定时功能);
  • 智能家居:温湿度传感器节点、智能门锁按键模块、简易窗帘控制器;
  • 小型工业控制:微型水泵驱动、设备开关量监测;
  • 电池供电设备:便携式加湿器、简易电子秤、红外遥控器。

六、产品优势与选型建议

  • 成本优势:小容量存储+紧凑封装,BOM成本低,适合入门级批量应用;
  • 易用性:合泰提供HT-IDE3000开发环境、专用编程器,资料齐全(数据手册、应用笔记),便于快速上手;
  • 升级兼容:若需更多存储(如4KB Flash)或外设(如UART),可无缝升级至HT66F005/HT66F006系列,保持开发逻辑一致。

HT66F004凭借“小体积、宽电压、低功耗、低成本”的核心优势,成为嵌入式入门应用的理想选择,尤其适合对功能需求简单、成本敏感的产品设计。

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