WMSIC Electronic Components

HANRUN HR661520E

ModelHR661520E
PackageSMD-16P
BrandHANRUN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HANRUN HR661520E
Type
HANRUN
Minimum package
18 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HANRUN
Electronic Component
HR661520E
Electronic Component
1
Package
SMD-16P
Electronic Component
Transformer
Electronic Component
10/100 Base-T
Electronic Component
1.4g
Inductor
350uH
Electronic Component
1
Electronic Component
BM0264213485
Operating Temperature
40℃~+85℃
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
18
Voltage(Vrms)
3kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HR661520E 产品概述

HR661520E 是 HANRUN(汉仁) 提供的一款面向 10/100Base-T 以太网应用的磁性元件(以太网变压器/共模电感)。该器件采用 SMD-16P 表面贴装封装,单口设计,电感值为 350 µH,额定隔离电压 3 kVrms,工作温度范围 -40℃ 至 +85℃,适用于工业级和商用网络接口模块,能够在有限空间内提供良好的信号完整性和共模干扰抑制。

一、产品核心参数

  • 品牌:HANRUN(汉仁)
  • 型号:HR661520E
  • 额定频率/速率:10/100 Base-T
  • 电感值:350 µH(典型,共模)
  • 端口数量:单口(1 Port)
  • 隔离电压:3 kVrms
  • 工作温度:-40℃ ~ +85℃
  • 封装:SMD-16P(表面贴装,16 引脚)

二、产品特性与优势

  • 小体积、高集成度:SMD-16P 封装适合高密度 PCB 布局,利于表面贴装自动化生产。
  • 良好的共模抑制能力:350 µH 的共模电感可有效抑制来自电缆的共模噪声,有助于通过 EMI/EMC 测试。
  • 高隔离耐压:3 kVrms 隔离电压提供可靠的安全隔离能力,适用于需要增强绝缘的网络设备。
  • 宽温度范围:-40℃ 至 +85℃ 的工作温度满足工业级环境需求,可靠性高。
  • 专为 10/100Base-T 设计:在 10/100 Mbps 速率下保持数据完整性,兼容常见以太网 PHY 和连接器接口。

三、典型应用场景

  • 工业以太网交换机、路由器与网关
  • 嵌入式以太网主板与通信模块
  • PoE(受限端口)接口电路(需配合设计验证)
  • 网络摄像头、智能家居网关、LAN 端口磁性过滤模块
  • 需高隔离和抗干扰能力的通信设备

四、设计与使用建议

  • PCB 布局:磁性器件应靠近 RJ45 或 PHY 芯片放置,尽量减少走线长度以降低串扰和损耗。器件两侧的差分信号对走线应成对对称且等长。
  • 接地处理:保持变压器原始绕组与系统接地的合理隔离,使用专用回流路径和适当的接地平面,避免在器件下方放置敏感模拟电路。
  • 隔离间距:保证印制板上的爬电距离和对地间隙满足设计的安全等级要求,配合器件 3 kVrms 的隔离能力进行系统评估。
  • 焊接工艺:遵循表面贴装元器件的回流焊工艺,参考厂家提供的焊接温度曲线与可焊性建议,避免重复多次高温回流。
  • ESD 与浪涌:尽管器件有共模抑制功能,但需要在系统中配合 TVS、浪涌保护器件与滤波网络以满足更高的抗扰度要求。

五、可靠性与测试

  • 隔离测试:典型隔离电压 3 kVrms,应在生产/检验阶段进行 HiPot 测试以确认绕组间绝缘。
  • 温度循环:推荐在目标应用温度范围内进行环境和温度循环测试,验证长期稳定性。
  • 振动与冲击:针对工业应用,建议进行机械震动与冲击测试以确认焊接和结构强度。
  • EMC 性能:在完整系统中进行传导和辐射发射/抗扰度测试,确保满足当地法规和客户要求。

六、封装与引脚说明

  • 封装形式:SMD-16P,适合自动贴装与回流焊工艺。
  • 引脚功能:16 引脚通常包含变压器/磁性网络的差分输入/输出以及中性线/屏蔽连接端(具体引脚定义请参照厂家引脚图与数据手册)。在设计前务必获取并参照官方数据手册上的机械尺寸和引脚排列,以免布线错误。

七、选型与采购建议

  • 在选型阶段,应确认是否需要集成脉冲变压器或仅为共模电感,以及器件在目标频带的插损、回波损耗(Return Loss)和隔离特性。
  • 采购时请向供应商确认产品批次的电感公差、DCR、额定电流和关键信息,并索取最新的数据手册与可靠性报告。
  • 如需在 PoE 应用中使用,请与供应商确认器件的电流承载能力和发热特性。

如需进一步的电气参数(如 DCR、插入损耗、回波损耗、引脚图和机械尺寸)或 PCB 布局建议,可提供您现有的电路图与尺寸要求,我将协助匹配并给出更具体的设计指导。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.