WMSIC Electronic Components

HL 50P03D

Model50P03D
PackageDFN3x3
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 50P03D
Type
HL
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
50P03D
Electronic Component
1
Package
DFN3x3
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.115g
Electronic Component
1
Electronic Component
BM0265846989
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
5.2W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
30V
Capacitor(Ciss)
1.77nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

50P03D P沟道MOSFET产品概述

50P03D是富海微(HL)推出的一款低电压大电流P沟道增强型MOSFET,针对导通损耗、开关速度及空间尺寸优化设计,具备宽温适应性与高可靠性,采用DFN3x3小封装,可广泛应用于便携电子、低压电源、工业控制等场景,是替代传统继电器或高损耗开关器件的理想选择。

一、产品定位与核心应用方向

50P03D定位于低压直流系统的功率开关器件,核心覆盖12V/24V常见电压平台,以“大电流承载+低损耗+小型化”为设计目标,解决传统开关器件在小型化设备中效率低、发热大的痛点。其主要应用方向包括:

  • 便携电子设备的电池充放电控制
  • 低压DC-DC转换器(12V/24V转5V/3.3V)
  • 大电流负载开关(如LED驱动、小电机控制)
  • 工业控制模块的输入输出电路
  • 车载辅助电源系统(USB充电、照明控制)

二、关键电气参数详细解析

1. 电压与电流承载能力

  • 漏源击穿电压(Vdss):30V
    覆盖12V/24V系统的电压波动范围(车载12V系统峰值可达24V),无需额外降额设计,保障系统稳定性。
  • 连续漏极电流(Id):50A(@25℃)
    支持持续大负载工作,脉冲电流能力(典型值为连续的2~3倍)可应对瞬间负载波动(如电机启动),满足多数低压大电流场景需求。

2. 导通损耗与功率效率

  • 导通电阻(RDS(on)):8.7mΩ
    低导通电阻直接降低导通损耗(公式:(P=I^2R)),50A负载下导通损耗仅约2.175W,比同类产品平均水平低15%以上,显著提升系统效率。
  • 最大耗散功率(Pd):5.2W
    配合封装热设计,可稳定支撑持续工作时的热耗散,避免器件过热失效。

3. 栅极控制与开关特性

  • 阈值电压(Vgs(th)):1.6V(@Id=250μA)
    低阈值电压使器件易被3.3V/5V MCU直接驱动,无需额外栅极驱动电路,简化系统设计。
  • 栅极电荷量(Qg):22nC(@Vgs=10V,Id=50A)
    低Qg意味着开关过程中栅极充放电损耗小,切换速度快,适合高频DC-DC转换器(开关频率可达1MHz以上)。
  • 电容特性:Ciss=1.77nF,Crss=206pF(@Vds=15V,f=1MHz)
    低输入电容与反向传输电容进一步提升开关速度,减少电磁干扰(EMI)。

4. 宽温环境适应性

  • 工作温度范围:-55℃~+175℃
    覆盖工业级与汽车级温宽(部分汽车级要求-40~150℃),可稳定工作于极地设备、发动机舱附近等极端环境,无需额外散热或温度补偿。

三、封装与热管理特性

采用DFN3x3封装(无引脚扁平封装),尺寸仅3.0mm×3.0mm×0.8mm,相比传统TO-252封装体积缩小约60%,适配便携式设备、高密度电路板的小型化布局。

DFN封装通过裸露焊盘直接连接PCB散热铜箔,热阻(R_{th(j-a)})约35℃/W,可快速将器件热量传递至系统,保障5.2W功率下的稳定工作。

四、选型核心优势总结

50P03D相比同类30V/50A P沟道MOSFET,具备以下核心竞争力:

  1. 低损耗效率:8.7mΩ导通电阻,50A负载损耗仅2.175W,效率提升10%以上;
  2. 快速开关:22nC低栅极电荷+低电容,支持1MHz高频应用;
  3. 宽温可靠:-55~175℃温宽,适配极端环境;
  4. 小型化设计:DFN3x3封装,满足设备轻薄化需求;
  5. 易驱动:1.6V低阈值,兼容3.3V/5V控制电路。

五、典型应用案例参考

  • 笔记本电脑电池管理:作为充放电开关,低导通电阻延长电池续航;
  • 车载USB快充:12V转5V降压电路的高端开关,宽温适配发动机舱高温;
  • LED背光驱动:大电流负载开关,避免负载压降导致的亮度异常。

50P03D凭借低损耗、快开关、宽温及小型化特性,为低压大电流场景提供了高性价比的功率开关解决方案,助力系统实现高效、小型化与高可靠性设计。

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