WMSIC Electronic Components

HL 30P03

Model30P03
PackageTO-252
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 30P03
Type
HL
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
30P03
Electronic Component
1
Package
TO-252
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.474g
Electronic Component
1
Electronic Component
BM0265847000
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
4W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HL富海微30P03 P沟道MOSFET产品概述

一、核心参数概览

30P03作为一款中低压P沟道MOSFET,核心参数覆盖低压功率场景的关键需求,具体如下:

  • 电参数:漏源击穿电压(V_{dss}=30V)(满足5V/12V系统耐压),连续漏极电流(I_d=25A)(支持中等功率负载连续工作),导通电阻(R_{DS(on)}=35mΩ@V_{gs}=10V)(低损耗核心指标),阈值电压(V_{gs(th)}=2.5V@I_d=250uA)(P沟道实际为-2.5V,驱动门槛适中);
  • 热参数:最大耗散功率(P_d=4W)(TO-252封装额定散热能力),工作温度范围(-55℃\sim+150℃)(适应极端环境);
  • 电容参数:输入电容(C_{iss}=982pF),反向传输电容(C_{rss}=109pF),栅极电荷量(Q_g=10nC)(平衡开关速度与损耗)。

二、封装与品牌背景

30P03采用TO-252封装(DPAK),是贴片式功率封装的典型代表,具备以下优势:

  • 引脚少(3脚)、布局紧凑(约6.5×5.0mm),适配自动化贴片焊接,节省PCB空间;
  • 散热性能优于SOT-23等小封装,支持4W以内连续耗散功率,无需额外散热片即可满足多数场景需求。

品牌方面,30P03由国内功率器件厂商富海微(HL) 推出。富海微专注中低压MOSFET、IGBT研发,产品覆盖消费电子、工业控制等领域,30P03是其针对低压大电流场景推出的高性价比器件。

三、典型应用场景

结合参数特性,30P03的典型应用集中在低压、中等电流的P沟道开关场景:

  1. 低压电源负载开关:如12V系统的电池供电切换、负载通断控制,25A电流支持多并联负载,30V耐压满足过压防护;
  2. 锂电池保护电路:作为高侧开关用于锂电池组充放电控制,P沟道高侧驱动无需浮地,简化电路设计,宽温范围适配户外设备;
  3. 便携式电子设备:笔记本电脑、移动电源的电源管理模块,TO-252封装适配紧凑空间,低导通电阻降低损耗、延长续航;
  4. 小功率电机驱动:小型直流风扇、玩具电机的方向控制,30V耐压覆盖电机反电动势,25A电流支持中等扭矩启动。

四、性能优势分析

30P03在同类型器件中具备明显竞争力:

  1. 低导通损耗:35mΩ导通电阻处于同参数段领先水平,在25A电流下导通损耗仅约21.9mW(需结合散热条件),大幅降低电源效率损失;
  2. 平衡的开关特性:(Q_g=10nC)适中,既避免Qg过小导致驱动电流过大,也不会因Qg过大增加开关损耗,适合100kHz以下开关频率;
  3. 宽温适应性:(-55℃\sim+150℃)覆盖工业级(-40℃~+85℃)甚至部分汽车电子低温需求,可靠性更高;
  4. 高性价比:国内厂商产品,性能相当但成本低于进口品牌,适合批量应用场景。

五、关键指标解读

几个核心参数的应用意义需重点关注:

  1. (V_{gs(th)})阈值电压:P沟道导通条件为(V_{gs}<V_{gs(th)})(实际-2.5V),普通5V MCU IO口即可驱动(输出-5V/0V),无需专用驱动芯片;
  2. (C_{rss})反向传输电容:109pF数值合理,减少开关时米勒效应导致的电压过冲与噪声,提升电路稳定性;
  3. (P_d)耗散功率:4W是无散热片的额定值,若PCB增加铜箔散热或加小型散热片,可进一步提升允许电流,适配更高功率需求。

总结

HL富海微30P03是一款专为低压、中等电流场景设计的P沟道MOSFET,凭借低导通电阻、宽温范围、紧凑封装及高性价比,成为消费电子、工业控制、便携式设备等领域的理想选择。其平衡的开关特性与可靠参数,可满足低压电源开关、电池保护等典型应用的核心需求。

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