WMSIC Electronic Components

HL 50N03

Model50N03
PackageTO-252
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 50N03
Type
HL
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
50N03
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.469g
Electronic Component
1
Electronic Component
BM0265793216
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
30.5W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

50N03 N沟道MOSFET产品概述

50N03是HL(富海微)推出的一款低电压大电流N沟道增强型MOSFET,专为≤30V低压、≥50A大电流场景设计,兼具低导通损耗、快开关速度与宽温适应性,适合工业电源、电机驱动、电池管理等领域的高密度应用需求。

一、产品基本信息与核心定位

50N03采用TO-252(DPAK)贴片封装,属于小体积功率器件范畴,核心定位为低压高电流开关/功率调节元件,重点解决传统低压MOSFET在大电流下导通损耗大、开关速度慢的痛点,同时兼顾宽温环境下的可靠性。

二、关键电气性能参数解析

1. 电压与电流承载能力

  • 漏源击穿电压(Vdss):30V:满足12V、24V等主流低压系统的安全电压余量(系统工作电压通常≤24V,30V击穿电压提供充足裕量);
  • 连续漏极电流(Id):50A:连续工作时可稳定承载50A电流,峰值电流能力进一步提升(虽未明确标注,但基于参数设计可满足瞬时过载需求),适合大电流输出场景。

2. 导通损耗与功率耗散

  • 导通电阻(RDS(on)):10mΩ@10V:栅极驱动电压10V时,导通电阻仅10毫欧,显著降低导通功率损耗(公式:P=I²×RDS(on),50A连续电流下损耗为25W,低于最大耗散功率);
  • 最大耗散功率(Pd):30.5W:连续工作时允许的最大耗散功率,结合低导通电阻,可在大部分应用场景下无需额外散热即可稳定运行(若需长期满载,可通过PCB铜箔优化散热)。

3. 开关特性与电容参数

  • 栅极电荷量(Qg):19nC@10V:低栅极电荷意味着开关速度快,适合高频(如数百kHz)DC-DC转换等应用,减少开关损耗;
  • 电容特性:输入电容Ciss=1.011nF、反向传输电容Crss=119pF、输出电容Coss=142pF,电容参数平衡,既保证快速开关,又降低米勒效应导致的振荡风险,提升电路稳定性。

4. 阈值电压与温度适应性

  • 阈值电压(Vgs(th)):2.5V@250uA:阈值电压适中,避免低电压误触发(如3.3V/5V驱动时可靠工作),同时兼容常见MCU/驱动芯片的输出电压;
  • 工作温度范围:-55℃~+175℃:宽温覆盖工业级环境(如户外设备、车载电子的极端温度场景),可靠性更高。

三、封装设计与散热特性

50N03采用TO-252贴片封装,尺寸紧凑(典型值:6.5mm×5.5mm×1.6mm),适合高密度PCB布局;封装引脚设计兼顾电气连接与散热:

  • 漏极引脚(D)与PCB焊盘面积较大,可通过增加铜箔面积(如1oz铜箔下扩展至10mm²以上)提升散热效率;
  • 连续耗散功率30.5W下,配合合理的PCB设计,可满足大部分应用的散热需求,无需额外加装散热器。

四、典型应用场景

50N03的参数特性使其适配多类低压大电流场景:

  1. 低压DC-DC转换器:如12V转5V(大电流输出)、24V转12V的降压模块,低导通损耗提升转换效率;
  2. 负载开关:电池保护电路、电源切换模块(如多电源冗余系统),大电流通断能力满足负载需求;
  3. 小型电机驱动:直流电机、无刷电机的低电压驱动(如电动工具、小型机器人),50A电流覆盖多数小型电机的启动/运行电流;
  4. 电池管理系统(BMS):充放电回路的开关元件,宽温适应性适合新能源电池的工作环境;
  5. 太阳能微型逆变器:低压输入(如12V/24V光伏板)的小功率逆变,快开关速度提升逆变效率。

五、选型优势总结

对比同类30V/50A MOSFET产品,50N03的核心优势在于:

  • 低导通损耗:10mΩ导通电阻显著降低大电流下的功率损耗;
  • 快开关速度:19nC栅极电荷适配高频应用;
  • 宽温可靠性:-55℃~+175℃覆盖极端环境;
  • 小体积高密度:TO-252封装适合紧凑PCB设计;
  • 充足余量:连续电流50A、耗散功率30.5W,满足长期稳定运行需求。

综上,50N03是一款性能均衡、性价比突出的低压大电流N沟道MOSFET,可广泛应用于工业、消费电子、新能源等领域的功率电路设计。

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