WMSIC Electronic Components

HL 80N03

Model80N03
PackageTO-252
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 80N03
Type
HL
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
80N03
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.474g
Electronic Component
1
Electronic Component
BM0265846983
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
62.5W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
30V
Capacitor(Ciss)
4nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

80N03 N沟道MOSFET产品概述

一、核心参数总览

80N03是富海微(HL)推出的低压大电流N沟道功率MOSFET,核心参数精准匹配12V/24V等低压系统的功率控制需求:

  • 漏源击穿电压(Vdss):30V,覆盖常见低压电源及驱动场景;
  • 连续漏极电流(Id):80A(直流),单管即可承载大负载电流;
  • 导通电阻(RDS(on)):4.8mΩ(@Vgs=10V、Id=80A),低导通损耗显著;
  • 耗散功率(Pd):62.5W,结合封装散热能力满足中等功率输出;
  • 阈值电压(Vgs(th)):1.5V(典型值),兼容3.3V/5V低电压控制;
  • 栅极电荷量(Qg):31.6nC(@Vgs=4.5V),开关损耗处于均衡水平;
  • 电容特性:输入电容Ciss=4nF(@Vgs=15V)、反向传输电容Crss=530pF(@Vgs=15V),影响开关速度;
  • 工作温度范围:-55℃至+175℃,覆盖工业及汽车级宽温场景。

二、关键性能优势

结合参数特点,80N03具备以下核心竞争力:

  1. 低导通损耗:4.8mΩ导通电阻在同类产品中表现优异,80A电流下压降仅约0.38V,可大幅降低系统功率损耗,提升效率;
  2. 高电流承载:80A连续漏极电流无需并联器件即可驱动大负载(如电机、电池组),简化电路设计;
  3. 宽温可靠性:-55℃至+175℃的温度范围,适配高温工业环境(如变频器)或汽车电子(如车载充电)等 harsh 场景;
  4. 低阈值兼容:1.5V阈值电压支持3.3V/5V控制电路直接驱动,无需额外升压,减少系统成本;
  5. 均衡开关特性:适中的栅极电荷(31.6nC)和电容参数,兼顾开关速度与驱动难度,适合100kHz以下中等频率应用。

三、封装与可靠性设计

80N03采用TO-252封装(DPAK),兼顾安装便利性与散热能力:

  • 贴片式安装:适配自动化贴片生产,提高生产效率;
  • 散热适配性:封装焊盘面积较大,结合PCB铜箔可有效散发热量,支撑62.5W耗散功率;
  • 可靠性保障:封装材料符合工业级标准,抗振动、耐潮湿性能满足长期稳定运行,可适配汽车级AEC-Q101等可靠性要求(若需)。

四、典型应用场景

80N03的低压大电流特性使其广泛应用于以下领域:

  1. 低压DC-DC转换:12V/24V系统的降压转换器(如转5V/3.3V),低导通电阻提升转换效率;
  2. 电机驱动:小型直流电机、无刷电机的低压驱动(如电动工具、智能家居电机),高电流满足启动及运行需求;
  3. 电池管理系统(BMS):电动自行车、储能电池组的充放电回路开关,宽温特性适配户外环境;
  4. 负载开关:大电流负载(如LED显示屏、服务器电源)的通断控制,低损耗减少发热;
  5. 工业控制:PLC输出模块、传感器驱动的功率级电路,稳定宽温性能保障工业可靠性。

五、应用注意事项

为保障稳定运行,需注意以下要点:

  1. 栅极驱动:建议Vgs≥4.5V(充分导通),栅极需下拉电阻(防悬空),避免静电损坏;
  2. 散热设计:TO-252封装需PCB预留≥10cm²铜箔,高负载下加装小型散热片;
  3. ESD防护:生产、测试时佩戴静电手环,使用防静电工具(栅极易被击穿);
  4. 反向续流:大电流应用需并联续流二极管(或利用体二极管),避免漏源反向击穿;
  5. 电压限制:严格控制Vds≤30V,防止击穿损坏。

综上,80N03凭借低压大电流、低损耗、宽温可靠等特性,成为12V/24V系统功率控制的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.