WMSIC Electronic Components

HL S400N08TL

ModelS400N08TL
PackageTOLL-8L
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL S400N08TL
Type
HL
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
S400N08TL
Electronic Component
1
Package
TOLL-8L
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.956g
Electronic Component
1
Electronic Component
BM0265846992
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
468W
Electronic Component
Electronic Component
Electronic Component
2000
Voltage(Vdss)
80V
Capacitor(Ciss)
13.085nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S400N08TL(富海微HL)N沟道功率MOSFET产品概述

一、产品定位与核心优势

S400N08TL是富海微(HL)针对中压大电流功率回路推出的高性能N沟道MOSFET,主打「高电流承载、低导通损耗、宽温可靠性」三大核心特性,精准适配工业电源、新能源车载、电机驱动等对功率密度要求严苛的场景。不同于常规80V耐压器件,其在400A连续漏极电流下仍保持低导通电阻,且支持-55℃至+175℃的宽温范围,解决了高温环境下功率衰减的痛点,是高负荷回路的优选器件。

二、关键参数深度解析

(一)电学性能核心参数

  • 耐压与电流能力:漏源击穿电压(Vdss)80V,覆盖中压(<100V)功率场景;连续漏极电流(Id)400A(典型值),是同电压级TOLL封装中的高电流水平,可稳定承载电机启动、电源切换等大电流瞬间。
  • 低导通损耗:栅极驱动10V(常规电压)下,导通电阻(RDS(on))仅1.05mΩ,远低于同类产品平均水平,能将功率回路导通损耗降低30%以上,提升系统效率(如电源转换效率可提升0.5%-1%)。
  • 散热能力:最大耗散功率(Pd)468W,配合TOLL封装的低热阻设计,可有效散发热量,避免器件过热降额。

(二)开关特性与电容参数

  • 开关损耗平衡:栅极总电荷(Qg)243.6nC(10V驱动下),兼顾开关速度与损耗——虽比低Qg器件略高,但适配400A大电流的开关需求,避免因Qg过低导致电流能力不足。
  • 电容特性优化:输入电容(Ciss)13.085nF、反向传输电容(Crss)120pF、输出电容(Coss)2.615nF,其中Crss较小可减少米勒效应,提升开关稳定性;Coss控制了电压过冲,降低EMI风险。

(三)可靠性与阈值参数

  • 宽温工作范围:-55℃至+175℃结温,超过工业级器件150℃的常规上限,适合汽车发动机舱、高温工业现场等恶劣环境。
  • 阈值电压稳定:栅源阈值电压(Vgs(th))3V(250uA测试条件),兼容主流驱动芯片(4.5V-15V驱动范围),避免误触发或驱动不足。

三、TOLL封装的设计优势

S400N08TL采用TOLL(TO-Leadless)无引脚封装,相比传统TO-247封装具备三大优势:

  1. 低寄生参数:无引脚结构减少30%寄生电感与电阻,提升开关速度,降低噪声与损耗;
  2. 高功率密度:封装尺寸10mm×12mm,比TO-247节省40% PCB空间,适合高密度电源设计;
  3. 优异散热:底部直接接触PCB散热铜箔,热阻更低,配合468W耗散能力,满足持续高负荷运行。

四、典型应用场景

S400N08TL的参数特性适配多类高负荷场景:

  1. 工业电源:服务器电源PFC模块、48V转12V DC-DC转换器,低RDS(on)提升效率,400A电流满足多负载供电;
  2. 新能源车载:电动车车载充电机(OBC)AC/DC环节,宽温适配车载高温,高电流支持快充;
  3. 电机驱动:工业伺服电机、电动叉车驱动回路,大电流满足启动/加速峰值需求,低损耗降低电机发热;
  4. 储能系统:电池储能双向DC/DC转换器,宽温与高可靠性适配户外储能站温度变化。

五、选型价值总结

S400N08TL的核心价值体现在:

  • 性能均衡:80V耐压+400A电流+1.05mΩ低阻,覆盖多数中压大电流场景;
  • 可靠性突出:宽温范围+高Pd值,适合恶劣环境长期运行;
  • 设计友好:TOLL封装节省空间,兼容主流驱动芯片,降低系统设计难度。

对于追求高功率密度、低损耗、宽温可靠性的功率回路,S400N08TL是性价比突出的选型方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.