WMSIC Electronic Components

HL S80N04D

ModelS80N04D
PackagePDFN-8L(3x3)
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL S80N04D
Type
HL
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
S80N04D
Electronic Component
1
Package
PDFN-8L(3x3)
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.102g
Electronic Component
1
Electronic Component
BM0259484566
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
65.8W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
40V
Capacitor(Ciss)
1.98nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S80N04D 产品概述

一、产品简介

S80N04D 是富海微(HL)推出的一款高电流、低导通电阻的N沟增强型功率MOSFET,适用于中低压、高效率开关电源与功率管理场景。器件额定漏源电压为40V,封装为小尺寸高导热的PDFN-8L(3×3),在尺寸受限但需要较大导流能力的应用中具备明显优势。

二、主要电气参数

  • 漏源耐压 Vdss:40 V
  • 连续漏极电流 Id:80 A
  • 导通电阻 RDS(on):4.5 mΩ @ VGS = 10 V
  • 阈值电压 VGS(th):2.2 V(典型)
  • 总栅极电荷 Qg:32 nC @ VGS = 10 V
  • 输入电容 Ciss:1.98 nF
  • 反向传输电容 Crss:29 pF
  • 输出电容 Coss:455 pF
  • 最大耗散功率 Pd:65.8 W
  • 工作温度范围:-55 ℃ ~ +150 ℃

三、封装与热管理

PDFN-8L(3×3)封装在小体积下提供较好的热路径,但要发挥65.8 W的耗散能力,必须配合合理的PCB散热设计。推荐做法包括:在焊盘下和周围使用大面积铜箔、充分的过孔阵列连接到背面散热层、并保证良好的焊接工艺与热阻控制。实际允许的连续电流受焊盘、PCB铜厚、环境温度及散热条件影响,选型时应按系统热仿真或经验裕量计算。

四、性能亮点与开关特性

  • 低导通阻抗(4.5 mΩ @ 10 V)带来较小的导通损耗,适合高电流路径,能够显著降低导通压降和发热。
  • 中等栅极电荷(32 nC)意味着在较高开关频率下栅极驱动功耗与充放电时间需合理控制,适配驱动能力较强的驱动芯片或外加栅极驱动电路。栅极充电能量近似为 Qg·VGS/2 ≈ 160 nJ(以10 V驱动为例),在多通道并联或高频应用时需考虑驱动损耗。
  • 较小的 Crss(29 pF)有利于减小米勒效应对开关过冲的影响,改善栅极驱动稳定性。

五、典型应用场景

  • 同步整流器/降压转换器(buck)与多相电源管理
  • 高电流电源开关、负载开关、热插拔控制
  • 电机驱动前级、固态继电器和电源分配系统
  • UPS、逆变器及其他中低压高电流功率转换场合

六、选型与使用建议

  • 若工作电流接近或超过几十安培,务必按实际PCB散热能力重新评估Pd与结温,避免仅依据额定Id做设计。
  • 为降低开关振铃与过冲,推荐在门极串联小阻值栅阻(依系统开关速度调整)并做好布局,短而粗的门极回路有助于减小寄生电感。
  • 在并联使用时注意匹配导通电阻和热分布,必要时在每个器件上使用单独的电流检测与平衡措施。
  • 对于高频切换场合,应同时评估Coss与Crss对开关损耗与电压应力的影响,适当选用缓冲网络或钳位措施。

总结:S80N04D 以40V 耐压、低RDS(on) 和高电流承载能力为主要优势,适合要求高效率与小封装空间的功率开关应用。为获得最佳性能,请结合实际PCB散热设计与驱动电路优化使用。若用于关键系统,请参阅完整数据手册并进行热稳态与开关损耗验证。

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