WMSIC Electronic Components

HL 80N06

Model80N06
PackageTO-252
BrandHL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HL 80N06
Type
HL
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HL
Electronic Component
80N06
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.453g
Electronic Component
1
Electronic Component
BM0264092393
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
108W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

80N06 产品概述

一、概述

80N06 为富海微(HL)推出的高单元密度沟槽式 N 沟道 MOSFET,额定漏源电压 60V、连续漏极电流 80A,兼顾低导通损耗与开关性能,适用于中高电流同步降压和开关电源场景。器件通过全功能可靠性认证,符合 RoHS 及绿色环保要求,并实现 100% EAS(静电敏感性)测试,可靠性适配量产级应用。

二、主要参数

  • 类型:N 沟道 MOSFET
  • Vdss(漏源耐压):60V
  • Id(连续漏极电流):80A
  • RDS(on)(导通电阻):5.3 mΩ(典型)
  • Pd(耗散功率):108W
  • Vgs(th)(阈值电压):4V
  • Qg(总栅极电荷):90 nC @ Vgs=10V
  • Ciss(输入电容):4.136 nF
  • Crss(反向传输电容):257 pF
  • Coss(输出电容):286 pF
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:TO-252(DPAK)
  • 品牌:HL(富海微)

三、特性与优势

  • 低导通阻抗:5.3 mΩ 带来显著导通损耗降低,适合高电流路径使用。
  • 适中栅极电荷:Qg=90 nC 在保证低 RDS(on) 的同时兼顾开关损耗,适配常用门极驱动器。
  • 优化寄生电容:Ciss/Coss/Crss 比例有助于开关过渡控制与回灌能量管理。
  • 工艺与可靠性:沟槽结构与高单元密度工艺提升导通性能;符合 RoHS 与 EAS 测试要求,可靠性优良。

四、典型应用

  • 同步降压转换器(buck)功率开关
  • 服务器与通信电源模块
  • 工业电源与电机驱动前端开关
  • 高效率电源管理与分布式电源系统

五、设计注意事项与热管理

  • 栅极驱动:建议采用 10~12V 驱动电平以充分开通,注意根据开关速度选择合适门极电阻以控制振铃与 EMI。
  • 开关损耗:Qg 和 Coss/Crss 值提示在高频应用需权衡开关频率与效率,必要时考虑软开关或回灌吸收电路。
  • 热设计:封装为 TO-252,在实际应用中需通过铜厚与散热铜箔面积优化 PCB 热阻,必要时并联器件或加散热片以满足持续高电流条件下的温升要求。
  • 布局建议:漏极与源极走线宽厚,缩短寄生电感;在功率回路及栅极回路处布置充分去耦与阻尼元件以抑制振荡。

六、封装与合规

封装为 TO-252(DPAK),适合表面贴装与自动化生产。器件通过环保合规检测(RoHS),并完成厂商的可靠性与 EAS 抗静电测试,适合工业级量产使用。

综上,80N06 在 60V/80A 级别提供了低 RDS(on) 与可控开关特性,是同步降压与高电流开关电源设计中的优选 MOSFET。应用时关注栅极驱动与散热布局,即可发挥器件最佳性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.