WMSIC Electronic Components

HI-LINK HLK-B40

ModelHLK-B40
PackageSMD,9.5x14mm
BrandHI-LINK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HI-LINK HLK-B40
Type
HI-LINK
Minimum package
128 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HI-LINK
Electronic Component
HLK-B40
Electronic Component
1
Package
SMD,9.5x14mm
Electronic Component
Other Module
Electronic Component
1.19g
Electronic Component
1
Power
10dBm
Electronic Component
BM0229969685
Operating Voltage
3.3V
Interface Type
ADC;I2C;SPI;GPIO;PWM
Electronic Component
Bluetooth5.1
Communication
100m
Receiver
95dBm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HLK-B40 产品概述

一、产品概述

HLK-B40 是海凌科(HI-LINK)推出的一款小尺寸蓝牙无线通信模块,采用 SMD 封装(尺寸 9.5×14mm),工作电压 3.3V,支持蓝牙 5.1 协议,适合对尺寸、功耗和射频性能有一定要求的嵌入式设备。模块集成射频前端与常用数字/模拟接口,便于快速集成到终端产品中。

二、主要特性

  • 支持协议:蓝牙 5.1
  • 发射功率:+10 dBm(最大)
  • 接收灵敏度:-95 dBm
  • 通信距离:典型可达 100 m(视天线与环境而定)
  • 工作电压:3.3 V
  • 接口类型:ADC、I2C、SPI、GPIO、PWM
  • 封装:SMD,尺寸 9.5×14 mm

三、接口与引脚说明

模块提供丰富的外设接口,便于与 MCU 或其他控制器连接:

  • ADC:用于外部模拟信号采样
  • I2C:用于传感器或低速外设总线通信
  • SPI:用于高速外设或片上外设扩展
  • GPIO:通用输入/输出,可配置中断或控制信号
  • PWM:用于驱动指示灯、马达或作为模拟输出

具体引脚定义请参考模块引脚手册,以确保电平和复位、晶振等控制逻辑匹配。

四、性能指标

模块射频性能表现平衡:10 dBm 发射功率配合 -95 dBm 接收灵敏度,在开阔视距下可实现约 100 米的通信距离。实际通信范围受天线设计、周围障碍、电磁干扰和链路协议设置影响,应在目标应用环境中做实测验证。

五、建议应用场景

  • 智能家居控制与传感网络
  • 可穿戴设备与健康监测
  • 工业无线遥控与数据采集
  • 智慧楼宇设备互联
  • 低功耗物联网节点(需配合合理休眠策略)

六、设计与使用注意事项

  • 供电稳定:3.3V 电源需具备足够滤波与去耦(建议近模块放置电容),避免电源纹波影响射频性能。
  • 天线与地平面:天线布局和地平面对通信距离影响显著,建议遵循厂家参考设计或使用外置匹配天线方案。
  • EMC 与屏蔽:射频模块应远离强干扰源,必要时采用屏蔽罩并注意散热。
  • 接口电平:外部 MCU 接口电平需匹配 3.3V,避免直接接入 5V 信号。
  • 固件与协议调试:蓝牙参数(广播功率、连接间隔等)会影响功耗与连接稳定性,建议在开发阶段调优。

七、封装与外形

模块为 SMD 表贴封装,物理尺寸 9.5×14 mm,适合自动贴装与批量生产。具体焊盘布局与机械尺寸应参考官方封装图纸。

八、总结

HLK-B40 以小尺寸与多接口为优势,适合需要蓝牙 5.1 功能且对空间有要求的终端产品。凭借 +10 dBm 发射功率和 -95 dBm 灵敏度,可在多数场景下提供可靠通信能力。集成丰富的 ADC/I2C/SPI/GPIO/PWM 接口,有利于缩短产品开发周期。实际使用建议遵循电源、天线和接口电平的设计规范,并在目标环境中进行通信覆盖验证。

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