WMSIC Electronic Components

Infineon ISC028N04NM5ATMA1

ModelISC028N04NM5ATMA1
PackageTDSON-8FL
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon ISC028N04NM5ATMA1
Type
TDSON-8FL
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
ISC028N04NM5ATMA1
Electronic Component
1
Package
TDSON-8FL
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
2.36g
Electronic Component
1
Electronic Component
BM0230664902
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
3W;75W
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ISC028N04NM5ATMA1 产品概述

一、产品简介

Infineon ISC028N04NM5ATMA1 属于英飞凌 OPTIMOS 系列 40V N 沟 MOSFET,封装为 TDSON-8FL。该器件针对中高电流开关应用优化,典型参数包括:Vdss = 40V,导通电阻 RDS(on) = 2.8 mΩ @ VGS=10V (I=50A),栅极电荷 Qg = 38 nC @10V,输入电容 Ciss = 2.7 nF,输出电容 Coss = 750 pF,反向传输电容 Crss = 130 pF。阈值电压 Vgs(th)=3.4V,工作结温可达 +175°C(Tj)。

二、关键参数解析

  • 低导通电阻(2.8 mΩ):在 40V 级别中提供极低的导通损耗,适合高效率、低压降的电源与功率开关场合。
  • 高电流能力:规格中列出 121A 与 24A(需参照完整数据表明确为脉冲或稳态、不同测量条件下的数值),体现器件在适当散热条件下可承载较大电流。
  • 中等栅极电荷(38 nC):栅极驱动能量与驱动器能力需兼顾,较高开关频率时栅极驱动损耗不可忽视。
  • 电容特性:Coss 与 Crss 对开关损耗、回收势能和栅源耦合有直接影响,影响开关过渡与 EMI。

三、性能与损耗估算(示例)

  • 导通损耗:在 50A 条件下,Pd(conduction) ≈ I^2·R = 50^2·2.8mΩ ≈ 7W,说明在大电流工作时需要良好散热。
  • 开关与驱动损耗:以 Vd=40V、fSW=100kHz 为例,Coss 导致的每次开关损耗约 0.5·Coss·V^2 ≈ 0.6 μJ,频率下为 ≈60 mW;栅极驱动能量为 Qg·Vdrive·f ≈ 38nC·10V·100kHz ≈ 38 mW。两者在中高频时均不可忽略。

四、典型应用

适用于汽车或工业的 12V/24V 到点对点 DC-DC 转换、同步整流、降压转换器、功率分配开关、马达驱动及负载开关等需要 40V 耐压与低导通电阻的场合。

五、布局与散热建议

  • 采用短且粗的漏-源回流路径,保证大电流回路阻抗最小;
  • 在 TDSON-8FL 底板使用充足铜面积与通孔散热至多层板大地铜皮;
  • 在栅极走线处并联合适阻尼与 RC 抑制振铃,防止 Crss 导致的电压尖升;
  • 设计时参考器件在 Ta 与 Tc 下不同 Pd 额定值,确保结温不超过额定范围。

六、选型参考

若系统可提供稳定 10V 栅压并需在 40V 级别实现高效率与大电流,ISC028N04NM5ATMA1 是良好选择。对于 5V 直驱或极高开关频率场合,应评估在更低 Vgs 下的 RDS(on) 及驱动损耗,或考虑更低 Qg 的版本。最终选型请以完整数据手册与实际 PCB 热模型验证为准。

总结:该器件在 40V 类别中以超低 RDS(on) 和较高电流承载为优势,适用于需兼顾导通损耗与开关性能的电源与驱动设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.