WMSIC Electronic Components

Infineon FM24CL64B-GTR FM24CL64B

ModelFM24CL64B-GTR
PackageSOIC-8-150mil
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon FM24CL64B-GTR
Type
SOIC-8-150MIL
Minimum package
2500

Technical parameters

Electronic Component
INFINEON
Electronic Component
FM24CL64B-GTR
Electronic Component
1
Package
SOIC-8-150mil
Electronic Component
FRAM
Electronic Component
0.302g
Electronic Component
1
Electronic Component
BM0257588459
Electronic Component
64Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.65V
Operating Current
300uA
Current
3uA
Interface Type
I2C
Clock Frequency(fc)
1MHz
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FM24CL64B-GTR 产品概述

一、产品简介

FM24CL64B-GTR 是 Infineon(英飞凌)系列的非易失性 F-RAM(铁电随机存取存储器),容量为 64Kbit(8KB),采用标准 I2C 总线接口,封装为 SOIC-8(150mil)。与传统 EEPROM 相比,F-RAM 提供更高的写入耐久性、更低的写入功耗和即时写入响应,适合对频繁写入和高可靠性有要求的嵌入式存储场合。

二、主要参数

  • 接口类型:I2C(支持最高 1MHz 时钟)
  • 存储容量:64Kbit(8KBytes)
  • 工作电压:2.7V ~ 3.65V
  • 工作电流:典型 300 µA(工作模式)
  • 待机电流:典型 3 µA(待机/节能模式)
  • 时钟频率:最高 1 MHz(Fast-mode 或 Fast-mode Plus 兼容)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装形式:SOIC-8-150mil

(以上数值基于器件典型规格,具体性能请参考厂商数据手册以获取完整电气特性和极限值。)

三、核心特性

  • 高耐久性:F-RAM 可实现远高于传统 EEPROM 的写入循环次数(通常为 10^12~10^14 量级),非常适合频繁写入的应用场景。
  • 即时写入:写操作无需等待擦写周期,随机字节写入可立即完成,降低了系统复杂度与延迟。
  • 低功耗:工作电流和待机电流均较低,尤其在频繁短写和待机场景下,系统总功耗显著优于 EEPROM。
  • I2C 兼容性:与标准 I2C 协议兼容,易于与微控制器和总线系统集成。
  • 宽温度范围:工业级工作温度(-40 ℃ 至 +85 ℃),适配大多数工业与消费类环境。

四、典型应用场景

  • 工业控制与数据记录:参数记录、日志存储、工况数据频繁写入场合。
  • 智能电表与公共事业设备:需长期保存计量数据且写入频繁的设备。
  • 医疗与仪器仪表:关键参数保持与高可靠性写入。
  • 物联网与边缘设备:本地配置、校准数据、事件记录等。
  • 车载非关键系统(注意温度和资格要求):可用于车内信息记录,但若需汽车级高温(如 +125 ℃)应确认器件等级与认证。

五、引脚与封装(概要)

SOIC-8 封装通常包含以下功能引脚(具体引脚图与引脚序号请以厂商数据手册为准):

  • VCC:电源(2.7V~3.65V)
  • GND:地
  • SDA:I2C 数据线(双向)
  • SCL:I2C 时钟线
  • WP(写保护):用于硬件写保护(如有)
  • A0/A1/A2(地址引脚):用于在同一总线上实现多器件寻址(若支持)

封装后缀 -GTR 常用于标识制造/包装形式(例如无铅与卷带包装),实际含义请以供应商物料说明为准。

六、设计与使用建议

  • 电源与去耦:在 VCC 与 GND 之间并接 0.1 µF 陶瓷去耦电容,靠近器件引脚布局以抑制电源噪声。
  • I2C 上拉:SDA/SCL 需要上拉电阻至 VCC;常见取值范围 2.2kΩ~10kΩ,典型值 4.7kΩ(根据总线长度与速度调整)。
  • 写保护:在关键数据写入保护场景中,使用 WP 引脚实现硬件写保护,避免误写。
  • 多器件布署:若总线上有多个 I2C 存储器,确认地址引脚或器件地址设置以避免地址冲突。
  • 温度与可靠性:器件额定工作温度为 -40℃~+85℃,高温或恶劣环境下应考虑额外的热管理或选择更高等级器件。
  • 数据完整性:在写入关键记录时,建议配合校验(CRC)或冗余策略以提高系统容错能力。

七、与 EEPROM 的对比与采购注意

  • 优势:F-RAM 写入速度快、写入次数高、能耗低且无需擦写流程,通常在高频写入和高可靠性场景下优于 EEPROM。
  • 局限:F-RAM 单位存储成本可能高于大容量的 EEPROM/FLASH;在极端高温(>85 ℃)或要求汽车级认证的应用需确认器件等级。
  • 采购提示:选型时确认 -GTR 后缀的包装与合规性(如 RoHS、无铅),并获取最新的数据手册以核实电气参数、引脚排列和时序。若要在现有设计中替换 EEPROM,检查命令兼容性与寻址方式,通常可以作为兼容替代但需验证软件时序与总线负载。

总结:FM24CL64B-GTR 是面向工业与高频写入应用的低功耗、高耐久性 F-RAM 器件。其 I2C 接口与标准封装便于系统集成,可显著提升对频繁写操作场景下的数据可靠性与能效。欲获取详细时序、电气特性与典型应用电路,请参阅 Infineon 官方数据手册。

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