Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
IHHEC C0603X104K101T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- IHHEC C0603X104K101T
- Type
- IHHEC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C0603X104K101T
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.037g
- Electronic Component
- 1
- Electronic Component
- BM0265389815
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述: C0603X104K101T
基础信息
C0603X104K101T 是一款高性能的贴片多层陶瓷电容器（MLCC），由知名品牌 IHHEC（禾伸堂）制造。该电容器以其优越的电气性能和可靠性，广泛应用于各种电子设备和电路中，为设计工程师提供了坚实的支持。
电容器规格
- 商品分类：贴片电容 (MLCC)
- 容值：100nF（0.1µF）
- 材质(温度系数)：X7R
- 精度：±10%
- 额定电压：100V
- 封装：0603
主要特点
优异的电气性能：C0603X104K101T 具有较大的电容值（100nF）和合适的额定电压（100V），使其能够在各种工作条件下稳定运行，满足高性能电路的需求。
温度特性：采用X7R材料，这意味着该电容器在-55°C到+125°C范围内，电容值会有较小的变化，适合于多种温度环境下的应用。X7R电容器通常在温度变化较大的环境中表现良好，非常适合工业和消费电子设备。
体积小：0603封装尺寸（约1.6mm x 0.8mm）使得该电容器能够在空间受限的设计中使用，适合用于精密小型设备，如手机、平板电脑以及各种便携式电子产品。
高可靠性：禾伸堂作为知名的电子元器件制造品牌，C0603X104K101T 在生产过程中采用了严格的质量管理体系，确保每个电容器都能在高强度和长期使用中表现出色。
应用场景
C0603X104K101T 主要应用于多种电路的去耦和滤波用途，适合以下场景：
消费电子产品：在手机、平板电脑和其他便携式设备中，用作去耦电容，帮助提升电流的稳定性，减小电源噪声，为设备提供更稳定的供电。
工业控制：在工业自动化和控制系统中，电容器用于滤波和耦合，确保电路的高效运行，避免因电流波动造成的系统故障。
通信设备：用于各种通信设备的电源管理系统，提升信号的稳定性和传输质量，确保数据的可靠传输。
汽车电子：在汽车电子系统中，电容器起到滤波和能量储存的作用，保障电气系统的正常运作，提高车辆电子设备的安全性和可靠性。
安装和使用注意事项
在使用 C0603X104K101T 时，应注意以下几点：
焊接手法：由于其小巧的尺寸，要求在焊接过程中使用适当的焊接技术和设备，以避免对电容器的损坏。
安装位置：放置电容器时，最好将其放在电路板的适当位置，以最大限度地减少电路干扰和噪声影响。
环境考虑：尽量避免将电容器暴露在极端的温度和湿度条件下，以确保其性能的长期稳定。
结论
C0603X104K101T 是一款性能优越、应用广泛的多层陶瓷贴片电容器，其卓越的电气特性和可靠性使其成为现代电子设计中不可或缺的元件。通过合理的安装和使用，此电容器能够为各类电子应用提供强有力的支持，满足不同电子设备对于稳定性的高要求。无论是在消费电子、工业控制还是汽车电子领域，C0603X104K101T 都能够提供卓越的性能表现，是电子设计工程师值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
