Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
IHHEC C0805X105K101T
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- IHHEC C0805X105K101T
- Type
- IHHEC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C0805X105K101T
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0264490348
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：C0805X105K101T 贴片电容
一、产品基本信息
产品名称: 贴片电容 (MLCC)
型号: C0805X105K101T
商品分类: 贴片电容 (MLCC)
容值: 1uF
材质: X7R
精度: ±10%
额定电压: 100V
封装尺寸: 0805
品牌: IHHEC（禾伸堂）
二、产品特性
C0805X105K101T是一种高性能的多层陶瓷电容器（MLCC），适用于各种电子电路的去耦和滤波应用。作为高频特性优良的电容器，这款电容采用X7R温度系数材料，确保在较宽的工作温度范围内保持优良的电容稳定性及可靠性，适合在-55°C到+125°C的环境中工作。
三、性能参数分析
电容值及公差:
- 容值为1uF，适合于低到中频率的去耦和耦合应用。
- 精度为±10%，在大多数应用中能够满足设计需求，提供较好的电容稳定性。
额定电压:
- 100V的额定电压，使其在大多数高压应用中表现出色，能够承受较高的脉冲电压和瞬时电压。
温度系数:
- 采用X7R材料，X7R温度系数意味着该电容在较宽的温度范围和施加直流偏压时，电容值变化较小，符合现代电子产品对高可靠性和长寿命的需求。
封装尺寸:
- 封装为0805（2.0mm x 1.25mm），这种小型表面贴装封装形式非常适合高密度PCB设计，便于在有限空间内实现更多的电路功能。
四、应用场景
C0805X105K101T贴片电容广泛应用于：
- 消费电子: 如手机、平板电脑、便携式电子设备中的电源去耦。
- 汽车电子: 在汽车控制模块中的信号滤波与电源去耦。
- 工业设备: 地面和家电设备中的电源管理和滤波应用。
- 通讯设备: 用于RF电路的信号耦合和去耦，以提高信号质量和设备的整体稳定性。
五、安装建议和注意事项
- 焊接工艺：由于其小型封装特性，建议使用自动回流焊接工艺，确保焊点质量。
- 布局设计：在PCB设计中，建议将电容置于离功率消耗部件（如芯片或电源模块）较近的位置，以降低电源噪声和抖动。
- 温度考虑：工作温度应满足其额定值，避免高温或极低温环境下工作，以保证电容性能稳定。
- 静电防护措施：在实际操作和存储过程中，注意做好静电防护措施，以避免造成元器件损坏。
六、结论
C0805X105K101T贴片电容是IHHEC（禾伸堂）推出的高性能电容器，凭借其优秀的电气性能、较高的额定电压和优良的温度特性，确保了其在各类电子应用中的可靠性与稳定性。无论是消费电子还是工业自动化，它都能满足不同领域对电子元器件的严格要求，成为设计工程师的优秀选择。无论在功能还是成本效率上，C0805X105K101T都体现了现代电子设计的高标准，值得广泛应用于各类电路设计中。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
