WMSIC Electronic Components

IHHEC SCC1808X102K502TS

ModelSCC1808X102K502TS
Package1808
BrandIHHEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
IHHEC SCC1808X102K502TS
Type
IHHEC
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
IHHEC
Electronic Component
SCC1808X102K502TS
Electronic Component
1
Electronic Component
1nF
Package
1808
Electronic Component
Capacitor
Electronic Component
±10%
Electronic Component
0.143g
Electronic Component
1
Electronic Component
BM0264490347
Operating Temperature
55℃~+125℃
Electronic Component
X1,Y2
Operating Voltage(AC)
250V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SCC1808X102K502TS 产品概述

一、产品简介

SCC1808X102K502TS 是禾伸堂(IHHEC)提供的一款用于电源与电磁兼容(EMC)抑制的安规贴片电容器。标称容量为 1nF,容差 ±10%(K),额定交流工作电压 250VAC,兼容 X1/Y2 安规等级,适用于需要线路抑制与线路对地抑制的场合。器件设计适应宽温度范围(-55℃ 至 +125℃),封装为 1808(贴片),兼顾小型化与耐久性。

二、主要性能与参数

  • 容值:1 nF
  • 容差:±10%(K)
  • 额定工作电压(AC):250 V
  • 安规等级:X1、Y2(用于跨线路与线路对地抑制的安规设计)
  • 工作温度范围:-55℃ ~ +125℃
  • 封装:1808(贴片封装)
  • 品牌:IHHEC(禾伸堂)

该型号针对电网脉冲、线路干扰与高频噪声提供稳定抑制能力,且具备安规元件所需的耐脉冲和绝缘性能设计。

三、特点与优势

  • 安规等级明确:同时覆盖 X1 与 Y2 类应用,便于在不同抑制位置选用同一型号,实现设计一致性。
  • 宽温度与稳定性:-55℃ 至 +125℃ 的工作温度区间,可满足工业级和严苛环境需求。
  • 小尺寸高密度:1808 封装利于表面贴装(SMT),便于自动化生产与 PCB 布局优化。
  • 品牌与质量:禾伸堂作为知名被动元件厂商,材料与制程对长期可靠性有保障。

四、典型应用场景

  • 开关电源(SMPS)的输入滤波与共模/差模抑制。
  • 家用电器与照明产品的电网干扰抑制。
  • 工业电源与变频器的 EMI 滤波电路。
  • 通过线路到接地的抑制元件(遵循 Y 类布线规范)。
  • 其他需要满足安规要求的电源接口与电磁兼容设计。

五、选型与使用建议

  • 用途区分:X 类用于线对线(跨相/跨火零),Y 类用于线对地(线对保护接地)。在设计时务必根据电路功能将该器件放置于相应位置并保证接地点可靠。
  • 安规设计注意事项:虽然器件具备 X1/Y2 等级设计,应结合系统整体安全等级与相关标准进行验证与认证。
  • PCB 布局:为保证滤波效果与安全间距,遵循厂商推荐焊盘与爬电/气隙距离要求。Y 类器件周围应避免信号层与敏感器件重叠。
  • 替换与容差:容值为 1nF ±10%,如需更严格容差或不同容量可按电路需求选择相近系列。

六、可靠性、存储与焊接建议

  • 存储:避免潮湿、高温与强光照射,建议在干燥、常温环境中存放,开封后按回流焊前置烘烤规程处理(如有厂商烘烤建议则优先遵循)。
  • 焊接:兼容常见无铅回流焊工艺;焊接温度与曲线请参考厂商资料以降低热应力与机械应力导致的微裂纹风险。
  • 可靠性检查:在关键应用中建议进行生命周期与耐脉冲试验、温度循环与绝缘耐压测试,以确认满足整机安全与 EMC 要求。

七、封装与交付

  • 封装形式:1808 表面贴装封装,适合自动贴装与回流焊接。
  • 供货:可按卷装或其他厂商提供形式交付,具体包装与起订量请咨询供应商或禾伸堂销售代表获取准确信息。

总结:SCC1808X102K502TS 是一款面向电源与 EMI 抑制的安规贴片电容,兼顾 X1/Y2 安全等级、小型化封装与宽温稳定性,适合对线路抑制和电磁兼容有严格要求的工业与消费类电子设计。购买与设计接入时,请结合整机安规认证流程与厂商具体焊接/存储指南进行实施。

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