Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
IHHEC C1210X475K101T
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- IHHEC C1210X475K101T
- Type
- IHHEC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C1210X475K101T
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.121g
- Electronic Component
- 1
- Electronic Component
- BM0264490352
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1210X475K101T 产品概述
1. 产品简介
C1210X475K101T 是一款由禾伸堂（IHHEC）生产的贴片多层陶瓷电容（MLCC），具有高容值、高电压和稳定的温度特性。该电容广泛应用于各种电子设备中，特别是在需要高可靠性和稳定性的电路中。
2. 关键参数
- 商品分类: 贴片电容（MLCC）
- 容值: 4.7µF
- 材质（温度系数）: X7R
- 精度: ±10%
- 额定电压: 100V
- 封装: 1210
3. 详细描述
3.1 容值与精度
C1210X475K101T 的容值为 4.7µF，精度为 ±10%。这意味着在实际应用中，电容的实际容值可能在 4.23µF 到 5.17µF 之间波动。这种精度适用于大多数通用电子电路，特别是在不需要极高精度的场合。
3.2 材质与温度特性
该电容采用 X7R 材质，具有较好的温度稳定性。X7R 材质的温度系数为 ±15%，在 -55°C 到 +125°C 的温度范围内，电容的容值变化不超过 ±15%。这使得 C1210X475K101T 适用于各种环境温度变化较大的应用场景。
3.3 额定电压
C1210X475K101T 的额定电压为 100V，这意味着它可以在高达 100V 的电压下稳定工作。这种高电压特性使其适用于电源滤波、DC-DC 转换器、以及其他高电压电路中。
3.4 封装尺寸
该电容采用 1210 封装，尺寸为 3.2mm x 2.5mm。这种封装尺寸在贴片电容中属于中等大小，既保证了较高的容值，又便于在紧凑的电路板上进行布局。
4. 应用领域
C1210X475K101T 广泛应用于以下领域：
- 电源管理: 用于电源滤波、稳压和 DC-DC 转换器中，提供稳定的电容支持。
- 通信设备: 在射频模块和信号处理电路中，用于滤波和耦合。
- 消费电子: 在智能手机、平板电脑、笔记本电脑等设备中，用于电源管理和信号处理。
- 工业控制: 在工业自动化设备中，用于电源滤波和信号处理，确保设备的稳定运行。
5. 品牌与质量
禾伸堂（IHHEC）是一家知名的电子元器件制造商，以其高质量和可靠性著称。C1210X475K101T 作为禾伸堂的产品，经过严格的质量控制和测试，确保在各种应用场景中都能提供稳定的性能。
6. 总结
C1210X475K101T 是一款高性能的贴片多层陶瓷电容，具有高容值、高电压和稳定的温度特性。其 4.7µF 的容值、±10% 的精度、100V 的额定电压以及 X7R 材质，使其适用于各种电子设备中的电源管理、信号处理和滤波应用。禾伸堂的品牌保证和 1210 封装尺寸，进一步提升了其在紧凑电路设计中的适用性和可靠性。无论是消费电子、通信设备还是工业控制，C1210X475K101T 都能提供卓越的性能和稳定性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
