WMSIC Electronic Components

IHHEC C1210X474K251T

ModelC1210X474K251T
Package1210
BrandIHHEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
IHHEC C1210X474K251T
Type
IHHEC
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
IHHEC
Electronic Component
C1210X474K251T
Electronic Component
1
Electronic Component
470nF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0264498376
Electronic Component
X7R
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C1210X474K251T 产品概述

一、概述

C1210X474K251T 为 IHHEC(禾伸堂)系列贴片多层陶瓷电容(MLCC),额定电压 250V,标称容值 470nF(474),容差 ±10%(K),介质为 X7R,封装 1210(公制 3225)。该型号在中高电压滤波、旁路去耦和噪声抑制等场合具有良好的体积/容量比与温度稳定性,适用于各类电源与工业电子设备。

二、主要参数

  • 容值:470nF(0.47µF)
  • 容差:±10%
  • 额定电压:250V DC
  • 介质类型:X7R(-55°C 至 +125°C,温度特性适中)
  • 封装:1210(3.2mm × 2.5mm)
  • 封装形式:贴片,常见为卷带供料(T 表示卷带包装)

三、性能与特性

X7R 介质在宽温度范围内提供中等稳定性,适合一般旁路与滤波用途但不适合要求高温度线性或高精度的定时电路。与薄膜电容相比,MLCC 具有更小体积、更低 ESR 与 ESL,响应速度快。需要注意的是,X7R MLCC 在施加直流偏压时会出现容值降低,具体衰减与尺寸、介质及偏压大小有关,设计时应参考厂商提供的偏压特性曲线并适当留有裕量。

四、典型应用

  • 开关电源输入/输出滤波与旁路
  • AC/DC 与 DC/DC 转换电路的去耦与 EMI 抑制
  • 工业控制、电机驱动与照明电源滤波网络
  • 传感器前端与信号链非高精度滤波环节

五、安装与可靠性建议

采用标准回流焊工艺,建议遵循 IPC/JEDEC 回流温度曲线,峰值温度一般以 260°C 为参考。贴装时注意焊盘尺寸和焊膏量,避免过量焊膏导致应力集中。为保证长期可靠性,储存于防潮包装中,焊接前如超出推荐时间需进行烘箱干燥处理。车辆级或高应力环境中应评估机械振动和热循环寿命。

六、选型与采购提示

型号命名中“C1210X474K251T”可拆解为:C(陶瓷)1210(封装)X(X7R)474(470nF)K(±10%)251(250V)T(卷带)。订购时确认需要的包装卷盘长度、焊接温度等级及是否有可靠性认证(如 AEC‑Q200)等。设计阶段如对温度/偏压下的实际容值有严格要求,建议向厂商索取偏压曲线与老化数据,以便准确评估电路性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.