WMSIC Electronic Components

IHHEC C1206X102K252T

ModelC1206X102K252T
Package1206
BrandIHHEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
IHHEC C1206X102K252T
Type
IHHEC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
IHHEC
Electronic Component
C1206X102K252T
Electronic Component
1
Electronic Component
1nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.005g
Electronic Component
1
Electronic Component
BM0264490366
Electronic Component
X7R
Voltage
2.5kV
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IHHEC禾伸堂C1206X102K252T 高压贴片电容产品概述

一、产品核心参数总览

IHHEC禾伸堂C1206X102K252T为高压多层陶瓷贴片电容(MLCC),型号字符对应核心参数:

  • C:陶瓷电容类型;
  • 1206:英制封装尺寸(0.12英寸×0.06英寸,公制3.2mm×1.6mm);
  • X7R:温度系数类别;
  • 102:容值1nF(10×10²pF);
  • K:容值精度±10%;
  • 252:额定电压2.5kV(25×10²V);
  • T:端接工艺或批次标识。

核心参数整理如下:

参数项 规格值 容值 1nF(102) 容值精度 ±10%(K级) 额定电压 2.5kV(直流/交流通用) 温度系数 X7R 封装尺寸 1206(3.2mm×1.6mm) 品牌 IHHEC(禾伸堂)

二、封装与物理特性

该产品采用1206标准贴片封装,厚度约0.8mm,重量仅0.02g左右,体积小巧且重量轻,可适配高密度PCB布局,降低整机体积。端接采用镍锡合金镀层,符合无铅环保要求,焊接兼容性强(适配回流焊、波峰焊),且端接强度满足JESD22-B102标准,避免焊接后脱落风险。

三、电气性能核心优势

  1. 高压耐受能力:2.5kV额定电压可覆盖中高压电路需求,避免电压击穿;
  2. 稳定精度:±10%容值精度满足多数工业级场景,无需额外校准;
  3. 低损耗:1kHz/1V条件下损耗角正切(tanδ)≤0.015,高频能量损耗小;
  4. 低ESR:1kHz频率下等效串联电阻(ESR)约5mΩ,减少电路发热,提升效率。

四、温度稳定性及适用范围

X7R温度系数的核心特性为**-55℃至+125℃宽温范围**,容值变化率控制在±15%以内(远优于Y5V材质的±20%~±80%)。该特性使其适配:

  • 户外设备(-40℃至+85℃);
  • 工业自动化(-20℃至+100℃);
  • 车载电子(-40℃至+85℃)等宽温场景,避免极端温度下容值漂移导致的电路失效。

五、典型应用场景举例

  1. 高压电源滤波:开关电源、LED驱动电源的高压侧滤波,过滤高频纹波;
  2. 医疗设备:高压发生器、除颤仪的耦合电容,需稳定容值与高压耐受;
  3. 工业自动化:PLC高压模块、高压传感器的信号耦合;
  4. 新能源:光伏逆变器、充电桩的高压滤波,适配电网侧高压;
  5. 通信基站:基站电源高压部分滤波,适配户外温度变化。

六、可靠性与质量保障

禾伸堂作为专业MLCC制造商,该产品通过多项可靠性测试并符合行业标准:

  • 高温存储:125℃下存储1000小时,容值变化≤±5%;
  • 温度循环:-55℃至+125℃循环500次,无失效;
  • 湿度负荷:85℃/85%RH下存储1000小时,性能稳定;
  • 环保认证:符合RoHS、REACH标准,无铅无卤。

以上特性使该产品成为中高压电路设计的可靠选择,覆盖工业、医疗、新能源等多领域需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.