Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1812N102J302T是禾伸堂(IHHEC) 推出的高压多层陶瓷贴片电容(MLCC),针对高电压、高精度应用场景优化设计。核心采用C0G(NP0)陶瓷介质,兼具低损耗、宽温稳定性的核心优势,是工业级、医疗级等对性能要求严苛领域的优选元件。
标称容值为1nF(对应EIA代码“102”),精度等级为±5%(EIA代码“J”),满足多数高精度电路的容值匹配需求。C0G介质的容值受温度、电压影响极小,是替代传统薄膜电容的理想选择。
额定直流电压为3kV,需遵循高压元件降额原则(建议降额≥50%,即实际工作电压≤1.5kV),避免过压击穿。温度系数为C0G,典型工作温度范围为-55℃至125℃,容值变化率≤±30ppm/℃,宽温下性能稳定可靠。
损耗因数(DF)典型值≤0.15%(1kHz测试条件),低损耗特性适合高频电路及高功率场景;绝缘电阻(IR)≥10^10Ω(25℃、10V直流),抗漏电性能优异,可有效减少电路损耗。
采用EIA 1812标准封装(英制尺寸:0.18in×0.12in,公制尺寸:4.5mm×3.2mm),典型厚度约1.0mm(具体以官方 datasheet 为准)。端电极采用镍/锡镀层,符合RoHS及无铅要求,适配自动化贴装设备,焊接兼容性好,可兼容常规回流焊/波峰焊工艺。
禾伸堂(IHHEC)作为专业陶瓷电容制造商,该产品通过多项行业可靠性测试:
无极性设计、陶瓷介质稳定性使其具备长寿命(典型>10^6小时),抗振动性能符合工业级标准(振动频率20~2000Hz,加速度1.5g),可适应严苛工况。
该产品凭借高压耐受、宽温稳定、低损耗等特性,可有效解决高电压场景下的滤波、耦合及储能需求,是工业控制、新能源等领域的高性价比选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products