WMSIC Electronic Components

IHHEC C1812N102J202T

ModelC1812N102J202T
Package1812
BrandIHHEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
IHHEC C1812N102J202T
Type
IHHEC
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
IHHEC
Electronic Component
C1812N102J202T
Electronic Component
1
Electronic Component
1nF
Package
1812
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.287g
Electronic Component
1
Electronic Component
BM0264490364
Electronic Component
C0G
Voltage
2kV
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C1812N102J202T 多层陶瓷贴片电容(MLCC)产品概述

C1812N102J202T是禾伸堂(IHHEC)推出的高压高稳定型多层陶瓷贴片电容(MLCC),采用1812封装,针对宽温、高压、高精度场景设计,凭借C0G介质的温度稳定性与2kV额定电压的耐受能力,成为工业控制、射频通信、精密仪器等领域的核心被动元件之一。

一、产品核心定位与身份标识

该型号属于禾伸堂高压C0G系列MLCC,型号命名清晰对应关键参数:

  • C:电容(Capacitor);
  • 1812:英制封装尺寸(0.18×0.12英寸,即4.57×3.05mm);
  • N:容值代码前缀;
  • 102:容值标识(10×10²=1000pF=1nF);
  • J:精度等级(±5%);
  • 202:额定电压(20×10²=2000V=2kV);
  • T:封装/工艺后缀(禾伸堂内部标识)。

产品定位为高压小容值、宽温高精度的通用型MLCC,适用于对容值稳定性、电压耐受要求严格的电路设计。

二、关键技术参数深度解析

1. 容值与精度

容值为1nF(1000pF),精度等级**±5%(J档)**——该精度可满足大多数工业级电路的容值匹配需求,无需额外校准即可实现稳定的滤波、耦合或匹配功能。

2. 额定电压与耐受能力

额定电压为2kV直流(DC),是核心高压特性:

  • 长期工作在2kV DC环境下无介质击穿、漏电流增大风险;
  • 脉冲电压耐受能力可达额定电压1.5倍以上(需参考datasheet具体要求)。

3. 温度系数与宽温特性

采用C0G(NP0)陶瓷介质,温度系数≤±30ppm/℃,是MLCC中温度稳定性最优的介质类型:

  • 工作温度范围**-55℃~125℃**,区间内容值变化率≤0.3%;
  • 频率特性优异:1kHz下损耗角正切(tanδ)≤0.15%,1MHz下Q值≥1000,适合高频电路。

4. 其他关键性能

  • 绝缘电阻(IR):25℃、10V DC下≥10¹⁰Ω,高压下无明显漏电流;
  • 可靠性测试:通过-55℃~125℃循环2000次、85℃/85%RH下2000小时(2kV DC)等严苛测试,容值变化≤±2%。

三、封装与物理特性

1. 封装尺寸与工艺兼容性

1812封装为表面贴装式(SMD),公制尺寸:

  • 长度:4.57±0.2mm;宽度:3.05±0.2mm;厚度:1.2±0.1mm(典型值)。

兼容常规SMT回流焊工艺(符合IPC/J-STD-020标准),适合高密度PCB布局,支持小型化设备设计。

2. 焊盘与可靠性设计

焊盘采用镍-锡(Ni-Sn)镀层,符合RoHS/REACH无铅环保要求,焊接附着力强;电极层为银-钯(Ag-Pd)合金,减少介质氧化与电极迁移风险。

四、材料与性能优势

1. C0G介质的核心价值

区别于X7R、Y5V等温度敏感型介质,C0G具有:

  • 零温度漂移(近似):宽温范围内容值无明显变化,避免电路参数随温度波动;
  • 低损耗:高频下能量损耗小,提升射频电路效率;
  • 高线性度:容值与电压、频率无关,适合精密模拟电路。

2. 高压工艺保障

禾伸堂采用多层共烧工艺(MLCC),介质层厚度均匀(≤10μm),电极层间距精准,确保2kV高压下的绝缘可靠性;同时通过激光微调优化容值精度,减少批量偏差。

五、典型应用场景

1. 高压滤波电路

开关电源、逆变器的高压侧滤波:滤除2kV DC电路中的高频噪声,避免干扰后级;

2. 射频匹配网络

基站、雷达、卫星通信的射频匹配电路:利用低损耗、高Q值特性实现信号阻抗匹配;

3. 精密测量仪器

示波器、信号发生器的前端电路:稳定容值确保信号采集精度,避免温度误差;

4. 工业控制设备

变频器、伺服系统的辅助高压电路:宽温(-40℃~85℃)环境下稳定工作,满足工业现场要求;

5. 医疗设备

高压电源模块、诊断设备的高压控制电路:高可靠性与环保特性符合医疗安全标准。

六、品牌与可靠性保障

禾伸堂(IHHEC)是全球领先的被动元器件制造商,拥有20+年MLCC研发经验,产品通过:

  • 国际认证:ISO 9001、ISO 14001、IEC 60384-1;
  • 环保认证:RoHS 2.0、REACH(无铅无卤);
  • 可靠性测试:机械冲击(1500g/1ms)、振动(20g/20-2000Hz)、寿命测试(125℃/2kV DC下1000小时)等。

C1812N102J202T提供完整datasheet与样品支持,适合量产与原型开发。

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