Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1210X106K050T 是一款由 IHHEC(禾伸堂)生产的贴片多层陶瓷电容(MLCC),具有高容值、高电压和稳定的温度特性。该电容广泛应用于各种电子设备中,特别是在需要高可靠性和稳定性的电路中。
C1210X106K050T 是一款高性能的贴片多层陶瓷电容,采用 X7R 材质,具有优异的温度稳定性和高容值。其容值为 10uF,额定电压为 50V,精度为 ±10%,封装尺寸为 1210(3.2mm x 2.5mm)。
该电容的容值为 10uF,适用于需要较大电容值的电路。其精度为 ±10%,确保了在大多数应用中的稳定性和可靠性。
C1210X106K050T 采用 X7R 材质,这种材质在 -55°C 到 +125°C 的温度范围内具有稳定的电容值变化。X7R 材质的温度系数为 ±15%,在宽温度范围内保持较高的稳定性,适用于各种环境条件下的应用。
该电容的额定电压为 50V,能够承受较高的电压应力,适用于高压电路中的应用。其高电压额定值确保了在高压环境下的可靠性和安全性。
C1210X106K050T 采用 1210 封装,尺寸为 3.2mm x 2.5mm。这种封装尺寸在贴片电容中属于中等大小,适用于大多数 PCB 设计,便于自动化贴装和焊接。
C1210X106K050T 广泛应用于各种电子设备中,特别是在需要高容值和高电压的电路中。其主要应用领域包括:
IHHEC(禾伸堂)是一家知名的电子元器件制造商,专注于高品质的贴片电容、电阻、电感等产品的研发和生产。禾伸堂的产品以高可靠性、稳定性和优异的性能著称,广泛应用于全球各地的电子设备中。
C1210X106K050T 是一款高性能的贴片多层陶瓷电容,具有高容值、高电压和稳定的温度特性。其广泛应用于电源管理、通信设备、消费电子、工业控制和汽车电子等领域。禾伸堂作为知名的电子元器件制造商,确保了该产品的高可靠性和稳定性,是各种电子设备中的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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