Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
IHHEC C1206N103J631T
Configuration
1 options
Configuration
Option 131153
Availability on request
Technical data
Product details
17
specifications
Core information
- Product name
- IHHEC C1206N103J631T
- Type
- IHHEC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C1206N103J631T
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.066g
- Electronic Component
- 1
- Electronic Component
- BM0265604332
- Electronic Component
- NP0
- Voltage
- 630V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1206N103J631T 产品概述
1. 产品简介
C1206N103J631T 是一款由IHHEC（禾伸堂）生产的贴片多层陶瓷电容（MLCC），具有高额定电压和优异的温度稳定性。该电容广泛应用于各种电子设备中，特别是在需要高电压和高稳定性的电路中。
2. 主要参数
- 商品分类: 贴片电容（MLCC）
- 容值: 10nF
- 材质（温度系数）: NP0（C0G）
- 额定电压: 630V
- 封装: 1206（3216 公制）
3. 产品特点
- 高额定电压: 630V的额定电压使得该电容适用于高压电路，如电源滤波、高压耦合等应用。
- 优异的温度稳定性: 采用NP0（C0G）材质，具有极低的温度系数，确保在不同温度环境下电容值保持稳定。
- 小型化设计: 1206封装尺寸（3.2mm x 1.6mm）使得该电容在空间受限的设计中具有优势。
- 高可靠性: 采用优质材料和先进制造工艺，确保产品在长期使用中的高可靠性和稳定性。
4. 应用领域
C1206N103J631T 适用于多种电子设备和电路，包括但不限于：
- 电源管理: 用于电源滤波、去耦和稳压电路，提高电源的稳定性和可靠性。
- 通信设备: 用于射频电路、信号耦合和滤波，确保信号传输的清晰和稳定。
- 工业控制: 用于高压控制电路、传感器接口和信号处理，提高系统的抗干扰能力和稳定性。
- 汽车电子: 用于车载电源管理、传感器接口和信号处理，确保在恶劣环境下的可靠运行。
5. 技术规格
- 电容值: 10nF ±5%
- 温度系数: NP0（C0G），±30ppm/°C
- 额定电压: 630V DC
- 工作温度范围: -55°C 至 +125°C
- 封装尺寸: 1206（3.2mm x 1.6mm）
- 介质材料: 陶瓷
- 电极材料: 镍屏障，锡涂层
6. 产品优势
- 高电压能力: 630V的额定电压使得该电容在高压应用中表现出色。
- 温度稳定性: NP0（C0G）材质确保电容值在不同温度下保持稳定，适用于宽温度范围的应用。
- 小型化设计: 1206封装尺寸适合高密度PCB设计，节省空间。
- 高可靠性: 优质材料和先进工艺确保产品在长期使用中的高可靠性和稳定性。
7. 使用注意事项
- 焊接条件: 建议使用回流焊或波峰焊，焊接温度应符合IPC标准。
- 存储条件: 应存储在干燥、无尘的环境中，避免高温和高湿。
- 使用环境: 避免在超过额定电压和温度范围的环境中使用，以免影响产品性能和寿命。
8. 结论
C1206N103J631T 是一款高性能的贴片多层陶瓷电容，具有高额定电压、优异的温度稳定性和小型化设计。适用于多种电子设备和电路，特别是在需要高电压和高稳定性的应用中表现出色。IHHEC（禾伸堂）作为知名品牌，确保产品的高可靠性和稳定性，是工程师和设计师的理想选择。
通过以上概述，用户可以全面了解C1206N103J631T 的主要参数、特点、应用领域和技术规格，从而更好地选择和应用该产品。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
