WMSIC Electronic Components

Jingdao Microelectronics BZT52C4V7SW

ModelBZT52C4V7SW
PackageSOD-323W
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic BZT52C4V7SW
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
BZT52C4V7SW
Electronic Component
1
Package
SOD-323W
Electronic Component
Zener Diode
Electronic Component
0.027g
Electronic Component
50
(Zzk)
500Ω
(Zzt)
80Ω
Electronic Component
BM0237586317
Diode
1
Current(Ir)
3uA@2V
Power Dissipation(Pd)
200mW
Electronic Component
4.4V~5V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C4V7SW 产品概述

一、产品简介

BZT52C4V7SW 是晶导微电子推出的一款独立式稳压二极管,标称稳压值 4.7V(允许范围 4.4V~5.0V),适用于小功率电源稳压、基准电压和浪涌/过压钳位。器件采用 SOD-323W 微小封装,体积小、适合高密度贴片电路。

二、主要电气参数

  • 稳压值(标称):4.7V;允许范围:4.4V~5.0V
  • 反向漏电流 Ir:3 μA @ 2V
  • 最大耗散功率 Pd:200 mW(无外部散热条件下)
  • 阻抗 Zzt:80 Ω;阻抗 Zzk:500 Ω
  • 工作结温范围:-55 ℃ ~ +150 ℃

三、特性与优势

  • 精准稳压:4.7V 标称值,适合 5V 近似要求的低功耗电路。
  • 低漏电流:在低压偏置下泄漏仅数微安,利于电池供电与低功耗设备。
  • 封装紧凑:SOD-323W 适合空间受限的消费电子与便携设备。
  • 容易贴片与自动化装配,成本低且可靠性高。

四、典型应用场景

  • 小信号参考源与局部稳压(如传感器、模拟前端)
  • 电源浪涌与过压保护、输入钳位
  • 电池管理与便携式设备的电压限制
  • 接口电路的保护和简单电压监控

五、封装与热管理

SOD-323W 封装热阻较大,器件 200 mW 的耗散能力受 PCB 版面和环境温度影响明显。实际使用时应按下列方式控制结温:

  • 使用足够的铜箔散热面,增加焊盘面积;
  • 在可能处加入散热过孔或铜箔层;
  • 在设计时按 Pd 计算最大允许电流 Iz_max ≈ Pd / Vz(以 4.7V 计约 42.6 mA),并考虑散热余量和温升,实际工作电流应低于该理论值。

六、选型与使用建议

  • 串联限流电阻计算公式:R = (Vin - Vz) / Iz;电阻耗散 P_R = (Vin - Vz) × Iz。
  • 为延长器件寿命和保证稳定性,建议在常温条件下将稳压电流控制在几毫安到十几毫安范围,避免长期接近最大耗散功率。
  • 在高温或高散热受限的设计中,请按热阻和环境温度进行额外的功率降额。

七、质量与供应

晶导微电子生产,器件适配自动化贴片工艺,并提供批量供应。选购时请确认规格表中的测试条件与包装形式以满足具体设计需求。若需更高功率或更低阻抗规格,可考虑封装更大或参数更优的系列元件。

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