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Jingdao Microelectronics SS56B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic SS56B
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- SS56B
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.251g
- Electronic Component
- 1
- Electronic Component
- BM0227375884
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 300uA@60V
- (Vf)
- 700mV@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS56B 产品概述
一、产品简介
SS56B 为晶导微电子推出的肖特基整流二极管，额定整流电流 5A，直流反向耐压 60V，封装为 SMB（DO-214AA）。器件以低正向压降与较高浪涌能力为特点，适用于需要高效率与低功耗的整流与保护场合。
二、主要性能参数
- 工作结温范围：-55℃ ~ +150℃
- 正向压降（Vf）：0.70V @ If = 5A
- 直流整流电流：5A
- 非重复峰值浪涌电流（Ifsm）：150A
- 直流反向耐压（Vr）：60V
- 反向电流（Ir）：300µA @ Vr = 60V
- 封装：SMB（表面贴装）
三、产品特点
- 低正向压降：在 5A 工作点 Vf ≈ 0.7V，可降低整流损耗，提高转换效率；
- 高浪涌承受力：150A 瞬态浪涌能力，能应对启动或短时冲击电流；
- 宽温度范围：-55℃ 到 +150℃，适合工业级与汽车电子的高温环境（详见系统热设计）；
- SMB 封装：适配中功率表面贴装工艺，兼顾散热与安装密度。
四、典型应用
- 开关电源整流与续流二极管（SMPS、适配器）；
- DC-DC 转换器输入/输出整流；
- 逆极性保护与负载旁路保护；
- 汽车电子、工业控制、电池管理与充电设备。
五、设计与使用建议
- 散热：尽管工作结温高，推荐在 PCB 上使用足够的散热铜箔与热过孔；在接近额定电流时注意结到外设的热阻，必要时配置散热器或加大铜面积；
- 反向漏泄：反向电流随温度上升显著增加，高温环境下应校核漏电对系统功耗或偏置的影响；
- 浪涌能力：150A 为非重复峰值，建议对重复或周期性浪涌进行外部保护或选择更高规格器件；
- 焊接与安装：遵循 SMB 封装的回流焊工艺规范，避免超出器件允许的焊接温度与时间。
六、封装与订购信息
- 封装类型：SMB（DO-214AA），适用于自动贴装与回流焊流程；
- 品牌：晶导微电子，型号：SS56B。详见厂商数据手册获取引脚定义、典型曲线和封装尺寸图。
如需完整电气特性曲线、热阻参数或封装尺寸图，可提供厂商数据手册或要求我帮您整理关键图表与参考布局建议。
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