WMSIC Electronic Components

Jingdao Microelectronics SMF64A

ModelSMF64A
PackageSOD-123FL
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic SMF64A
Type
Jingdao Microelectronics
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
SMF64A
Electronic Component
1
Package
SOD-123FL
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0228061679
Operating Temperature
55℃~+150℃
Voltage
103V
Current(Ir)
1uA
Voltage(VBR)
78.6V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF64A(64V)TVS二极管 — 产品概述

一、产品简介

SMF64A 是晶导微电子推出的一款瞬态电压抑制器(TVS)二极管,采用 SOD-123FL 小型封装,专为抑制工业及通信系统中的浪涌和瞬态过压设计。器件在限制浪涌电压、吸收脉冲能量方面性能优异,可保护敏感电子元件免受雷击、开关瞬变或感性负载释放产生的高压冲击。

二、主要参数

  • 反向截止电压 (Vrwm):64 V
  • 击穿电压 (Vbr):78.6 V
  • 钳位电压 (Vclamp):103 V(Ipp 条件下)
  • 峰值脉冲电流 (Ipp):1.7 A @ 10/1000 μs
  • 峰值脉冲功率 (Ppp):200 W @ 10/1000 μs
  • 反向电流 (Ir):1 μA(在 Vrwm 条件下)
  • 工作温度:-55 ℃ ~ +150 ℃
  • 类型 / 封装:TVS / SOD-123FL
  • 品牌:晶导微电子

三、特性与优点

  • 高能量吸收能力:在 10/1000 μs 浪涌窗下可承受 200 W 峰值功率,适用于中等能量冲击防护。
  • 良好钳位能力:在指定脉冲条件下钳位电压 103 V,有效限制后端电路暴露的峰值电压。
  • 低漏电流:反向漏电仅 1 μA,适合对待机功耗敏感的系统。
  • 宽温度范围:-55 ℃~+150 ℃,适应工业级温度环境。
  • 紧凑封装:SOD-123FL 有利于 PCB 布局与自动化贴装,节省布板空间。

四、典型应用场景

  • 48 V 电源与直流母线保护(如通信、PoE 电源侧)
  • 开关电源输入端与整流桥后端浪涌抑制
  • 工业控制、仪器仪表中的电源和信号线路防护
  • 电机驱动与感性负载侧抑制瞬态电压
  • 电池管理、充电系统过压浪涌保护

五、使用建议与注意事项

  • 选型原则:工作电压接近但不得超过 Vrwm(64 V),一般在系统持续电压下留有适当裕量以避免误触发。
  • PCB 布局:将 TVS 尽量靠近需保护的端口或接插件,接地回路短、粗且低阻,必要时在焊盘处增加散热铜箔或过孔以增强热耗散。
  • 浪涌能力:避免长期在接近额定脉冲条件下连续工作,超出 Ipp 或 Ppp 可能导致器件热失效。
  • 焊接工艺:SOD-123FL 封装兼容常见回流焊,但应遵循制造商推荐的回流曲线与预热/冷却参数,避免过高温度造成封装应力。
  • 安全余量:对重要系统可考虑并联或级联多级保护(TVS + 滤波/限流器)以提高可靠性。

六、封装与采购提示

SMF64A 提供适用于自动化贴片的 SOD-123FL 外形,便于量产组装。选购时请参考晶导微电子官方数据手册,获取完整的 IV、钳位特性曲线、热阻值及包装信息,以便在具体应用中进行热设计与可靠性评估。如需在特定浪涌工况下验证性能,建议结合实际负载与环境进行样机测试。

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