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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics US1B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic US1B
- Type
- Jingdao Microelectronics
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- US1B
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.12g
- Electronic Component
- 50
- Electronic Component
- BM0230630482
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA@100V
- (Vf)
- 1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US1B 产品概述
一、产品简介
US1B 是晶导微电子推出的一款独立式快恢复高效率整流二极管，适用于通用开关电源和功率整流场合。该器件在1A工作电流下正向压降低（Vf≈1.0V@1A），同时具备较短的反向恢复时间，兼顾导通损耗与开关损耗，适合频率较高的开关应用。
二、主要参数与特性
- 正向压降：1.0V @ 1A（典型），低压降有助于降低导通损耗。
- 直流反向耐压：100V，满足中等电压整流需求。
- 整流电流：1A（连续），适合小功率输出或整流桥模块。
- 反向电流：5µA @ 100V，漏电小，有利于降低空载损耗和漏电能耗。
- 反向恢复时间：50ns（典型），快恢复特性能显著降低开关损耗与电磁干扰。
- 非重复峰值浪涌电流：30A，具备较好的浪涌承受能力。
- 工作结温：-55℃ ~ +150℃（Tj），耐高温设计适合工业级应用。
- 封装：SMA，表面贴装，便于自动化贴装与高密度PCB设计。
三、结构与封装说明
SMA 封装体积小、热阻适中，适合常规功率器件布板。独立式封装方便作为单个整流或保护元件使用，也可组成整流桥或并联配置（并联时需注意电流均衡）。
四、典型应用场景
- 开关电源输出整流与回流二极管
- 充电器、适配器、LED驱动电源整流
- 逆变器与电机驱动的小功率回流保护
- 通用工业控制与消费电子的中低压整流场景
五、选型与使用建议
- 依据平均负载电流选择安全裕量，长期使用建议留出20~30%余量；
- 注意热管理与PCB散热，SMA 封装需靠铜箔散热或贴片旁加散热路径；
- 避免频繁超过Ifsm和高能冲击，必要时加入浪涌抑制措施；
- 对更低正向压降或更快响应的场合，可考虑肖特基或更高速的器件。
六、可靠性与注意事项
US1B 在额定温度范围内具有稳定的电气特性。焊接时遵循封装热曲线，避免超温或长时间加热；储存与使用环境应防潮、防腐蚀。晶导微电子提供常规尺寸与批量可溯源出货，适合工程样机验证与量产应用。
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