WMSIC Electronic Components

Jingdao Microelectronics 1SMA4740A

Model1SMA4740A
PackageSMA
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic 1SMA4740A
Type
Jingdao Microelectronics
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
1SMA4740A
Electronic Component
1
Package
SMA
Electronic Component
Zener Diode
Electronic Component
0.062g
Electronic Component
1
(Zzt)
7Ω
Electronic Component
BM0230630723
Diode
1
Current(Ir)
10uA@7V
Power Dissipation(Pd)
1W
Electronic Component
9.5V~10.5V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4740A 产品概述

一款由晶导微电子推出的独立式稳压二极管,标称稳压值 10V,稳压范围 9.5V~10.5V,适用于中低功率的稳压与参考场合。器件采用 SMA 封装,最大耗散功率为 1W,结温工作范围宽 (-55℃ ~ +150℃),具有良好的通用性与耐环境能力。本文对其电气特性、应用建议、热管理和选型要点进行技术性说明,便于工程设计和可靠性评估。

一、产品概述与定位

1SMA4740A 为独立式稳压(齐纳/稳压)二极管,主要作为并联稳压元件或基准电压源使用。器件特点是结构简单、成本低、适应宽温度范围,适合要求不高但需稳压保护或基准电压的消费类电子、仪表、通信终端和电源模块等场景。

二、主要电气参数

  • 标称稳压值(Vz):10V
  • 稳压范围:9.5V ~ 10.5V(工差范围)
  • 反向电流 Ir:10μA @ 7V(注:该项为泄漏/反向电流参考测量点)
  • 动态阻抗 Zzt:7Ω(表示稳压区电压随电流变化的短时阻抗)
  • 最大耗散功率 Pd:1W(在规定散热条件下)
  • 结温工作范围:-55℃ ~ +150℃
  • 封装:SMA(表面贴装,适合自动贴装与回流焊)

三、器件性能特点

  • 稳压值集中在 10V 附近,适合 10V 基准或局部稳压用途。
  • 相对较高的动态阻抗(7Ω)表明在电流变化时电压会产生可观波动,因此更适合作为低精度稳压或保护元件,而非高精度电压参考。
  • 反向漏电小(10μA@7V),在低电流场合有利于减少静态功耗,但请注意随电压和温度升高漏电会增长。
  • SMA 封装利于外形小、易于 SMT 贴装,适合批量生产。

四、工作与应用建议

  • 串联限流电阻:常用作并联稳压时需串接限流电阻 R,使二极管在允许的电流范围内工作。R = (Vs - Vz) / Itotal(Itotal = 二极管电流 + 负载/分流电流)。
    例:若 Vs = 12V,需要约 10V 输出,期望 Iz = 20mA,则 R = (12 - 10) / 0.02 = 100Ω,电阻功耗 P_R = (Vs - Vz) * Iz = 2V * 0.02A = 0.04W。
  • 最大电流限制:考虑 Pd = 1W,理论最大稳流 Iz_max ≈ Pd / Vz = 1W / 10V = 0.1A(100mA)。为保证长期可靠性与温升裕量,建议实际连续工作电流远低于该值(如 ≤ 30–50mA,根据散热条件而定)。
  • 电压波动估算:动态阻抗 Zzt = 7Ω 表示电流变化 ΔI 将引起电压变化 ΔV ≈ Zzt * ΔI。若电流变化 20mA,则 ΔV ≈ 0.14V,设计时应考虑该误差。

五、封装与热管理

  • SMA 封装热阻相对较大,器件的功耗能否安全散出很大程度上依赖 PCB 铜箔面积与焊盘设计。建议在焊盘下方和外围增加散热铜箔,并通过多层接地/电源铜层扩展热阻。
  • 在高环境温度下需对功率进行降额,参考结温上限 150℃,并留有安全裕度。连续运行时建议将耗散控制在 Pd 额定值的 50% 以下以提高寿命和稳定性。
  • 回流焊工艺需遵守供应商给出的焊接温度曲线(如无详细资料,遵循通用 SMT 回流工艺并避免过高峰值温度和长时间高温暴露)。

六、选型与注意事项

  • 若需高精度基准(误差远小于 ±5%),建议选用专用低温漂电压参考芯片;1SMA4740A 更适合成本敏感或对精度要求不高的稳压场合。
  • 留意实际工作电流与 Pd 的匹配,并做好温度与散热评估。
  • 反向电流 Ir 的测试条件为 7V,若工作电压远高于该值应检查漏电在高压和高温下的变化对电路的影响。
  • 对于脉冲或瞬态保护应用,请核对脉冲功耗能力与击穿特性,若需要抗浪涌能力应选用针对突发能量设计的器件。

七、典型应用电路示例

  • 并联稳压(最常见):输入经过限流电阻 R 后并联 1SMA4740A,为负载提供接近 10V 的稳压。适用于小功率传感器、模拟前端等。
  • 过压保护:将二极管并联在关键电源线上,当电压超过稳压值时导通,钳位电压防止后级元件被击穿(需配合熔断器或限流设计)。

八、可靠性与品质说明

晶导微电子出品,针对常温与工业温度范围设计,适合需要宽温度适应性的商业/工业产品。实际采购时建议向供应商索取完整数据手册(含曲线、热阻、封装示意及回流焊要求)以及可靠性测试报告(如有),以便进行更严格的热与电气评估。

如需我为该元件在您的具体电源设计中做电流、功耗与散热的详细计算(给定输入电压、负载电流与 PCB 尺寸),可以提供参数,我来帮您核算与优化。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.