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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics MB6S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MB6S
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MB6S
- Electronic Component
- 1
- Package
- MBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.214g
- Electronic Component
- 1
- Electronic Component
- BM0230856409
- Current
- 800mA
- Current(Ir)
- 5uA@600V
- (Vf)
- 1.1V@800mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB6S 产品概述
一、产品简介
MB6S 为晶导微电子出品的通用整流桥，采用紧凑的 MBS 封装，面向各类低功耗至中功率交流－直流整流场景。器件耐压高、漏电小、抗浪涌能力强，适用于需要可靠整流和稳定输出的民用与工业电子产品。
二、主要参数
- 工作结温范围：-55℃ ~ +150℃
- 额定整流电流：800 mA（DC）
- 正向压降 Vf：1.1 V @ 800 mA（单管）
- 非重复峰值浪涌电流 Ifsm：30 A
- 直流反向耐压 Vr（最大）：600 V
- 反向电流 Ir：5 µA @ 600 V
- 封装：MBS 说明：整流桥工作时每次通路由两只二极管导通，典型整流压降约为两倍单管 Vf（实际值随电流及温度略有变化）。
三、主要特性与优势
- 高耐压设计（600 V），适配高压输入场景；
- 低反向漏电（5 µA），保证轻负载下低静态损耗；
- 抗浪涌能力强（30 A），可承受瞬态启动与冲击电流；
- 宽温区可靠工作（-55℃ 至 +150℃），适合苛刻环境；
- MBS 紧凑封装，便于 PCB 布局与批量装配。
四、典型应用
- 开关电源整流、线性电源输出整流；
- 充电器、适配器与备用电源电路；
- 家用电器控制板、照明驱动和电机控制；
- 工业控制与仪表中的通用整流模块。
五、使用建议与可靠性注意事项
- 热管理：在连续 800 mA 负载下注意散热，增大 PCB 铜箔面积或采用散热器以降低结温，延长器件寿命并避免热失效；工作结温不应持续接近上限 150℃。
- 冲击电流保护：若存在频繁或高幅值浪涌，应配合合适的熔断器或限流元件，防止器件损坏。
- PCB 布局：建议短、粗的走线以降低串联电阻与电感，焊盘设计与焊接工艺按照 MBS 封装规范执行。
- 环境与清洁：避免长期潮湿与腐蚀性介质环境，清洗时使用与电子元件兼容的工艺，避免残留导电盐分。
- 安全合规：在高压场合应配合符合安全规范的隔离与保护措施。
六、订购与支持
型号：MB6S，品牌：晶导微电子，封装：MBS。如需大批量采购、样片测试或获取器件数据手册、热阻与封装图纸，请联系晶导微电子技术支持或授权经销商获取详细资料与应用参考。
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